Various examples are provided for superlattice conductors. In one example, a planar conductor includes a plurality of stacked layers including copper thin film layers and nickel thin film layers, where adjacent copper thin film layers of the copper thin film layers are separated by a nickel thin film layer of the plurality of nickel thin film layers. In another example, a conductor includes a plurality of radially distributed layers including a non-ferromagnetic core; a nickel layer disposed about and encircling the non-ferromagnetic core; and a copper layer disposed on and encircling the nickel layer. In another example, a hybrid conductor includes a core; and a plurality of radially distributed layers disposed about a portion of an outer surface of the core, the plurality of radially distributed layers include alternating ferromagnetic and non-ferromagnetic layers. In other hybrid conductors, the radially distributed layers can utilize magnetic and non-magnetic materials.

Provided is an electric wire structure including a copper (Cu) electric wire extending in a direction; and a graphene coating layer formed on an outer portion of the Cu electric wire to surround the Cu electric wire, wherein the Cu electric wire includes Cu having a purity of 99.9% or greater.

The present invention discloses a method for creating spin-affected electric currents passively and feeding them into electric devices. The invention can be realized as either a rectangular black box incorporating coatings on top of and on the bottom of a conducting volume of material, or by coating a round-shaped wire or thread(s) of a cable. This is obtained by using a specific coating material on the conducting piece of material. The material may be piezoelectric, such as silicon dioxide (i.e. quartz) but also silicon carbide (SiC) may be used. Also, mixtures and composite arrangements are possible in order to create a coating. The manufactured add-on unit, when supplied with the input power or input signal, will act as an electron spin feeding device to the electric device because the electrons will be moving strongly within the interface area of the coating and the conducting material with aligned spins. The resulting effect also lasts longer within the electric device than just the time when the add-on unit is connected to the electric device.

A plated fiber that is obtained by applying a metal plating onto a fiber having an elongation percentage which is more than or equal to 1% and less than or equal to 10%. An elongation percentage of the metal plating is higher than the elongation percentage of the fiber. A carbon fiber wherein the surface oxygen amount as a value obtained by dividing an O.sub.1S peak intensity measured by X-ray photoelectron spectroscopy by a C.sub.1S peak intensity measured by the spectroscopy is more than or equal to 0.097 and less than or equal to 0.138.

There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700 C. (preferably 350 to 650 C. and more preferably 450 to 600 C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 m and a crystallite diameter Dx.sub.(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

Elongated, ultra-high conductivity electrical conductors for use in advanced electronic components and vehicles, and methods for producing the same, are disclosed herein. The elongated electrical conductors include a conductor body that defines a longitudinal axis. The conductor body includes an isotropically conductive matrix material and a plurality of anisotropically conductive particles interspersed within the isotropically conductive matrix material. Each anisotropically conductive particle defines a respective axis of enhanced electrical conductivity that is aligned with the longitudinal axis of the conductor body. The methods include providing a bulk matrix-particle composite that includes the isotropically conductive matrix material and the plurality of anisotropically conductive particles. The methods further include forming the bulk matrix-particle composite into an elongated electrical conductor and aligning the plurality of anisotropically conductive particles such that the respective axis of enhanced electrical conductivity thereof is at least substantially aligned with the longitudinal axis of the elongated electrical conductor.

A copper alloy wire rod has a chemical composition comprising Ag: 0.1 to 6.0 mass % and P: 0 to 20 mass ppm, the balance being copper with inevitable impurities. In a cross section parallel to a longitudinal direction of the wire rod, a number density of second phase particles each having an aspect ratio of greater than or equal to 1.5 and a size in a direction perpendicular to the longitudinal direction of the wire rod of less than or equal to 200 nm is greater than or equal to 1.4 particles/m.sup.2.

A nanostructure barrier for copper wire bonding includes metal grains and inter-grain metal between the metal grains. The nanostructure barrier includes a first metal selected from nickel or cobalt, and a second metal selected from tungsten or molybdenum. A concentration of the second metal is higher in the inter-grain metal than in the metal grains. The nanostructure barrier may be on a copper core wire to provide a coated bond wire. The nanostructure barrier may be on a bond pad to form a coated bond pad. A method of plating the nanostructure barrier using reverse pulse plating is disclosed. A wire bonding method using the coated bond wire is disclosed.

There is provided an electrically conductive paste which can prevent the increase of the volume resistivity of an electrically conductive film formed from the electrically conductive paste even if the electrically conductive film is heated to a soldering temperature of about 380 C. when the electrically conductive paste is a resin type electrically conductive paste using a silver powder and a silver-coated copper powder. In an electrically conductive paste containing a resin, a silver powder and a silver-coated copper powder having a copper powder, the surface of which is coated with a silver layer, the resin is an epoxy resin having a naphthalene skeleton, and there is added a dicarboxylic acid, preferably a dicarboxylic acid having a rational formula of HOOC(CH.sub.2).sub.nCOOH (n=1-8), and more preferably a dicarboxylic acid having a rational formula of HOOC(CH.sub.2).sub.nCOOH (n=4-7).

Provided is a fabric including a plurality of fibers disposed in a fabric configuration. At least one of the fibers comprises a device fiber having a device fiber body including a device fiber body material, having a longitudinal axis along a device fiber body length. A plurality of discrete devices are disposed as a linear sequence within the device fiber body along at least a portion of the device fiber body length. Each discrete device includes at least one electrical contact pad. The device fiber body includes device fiber body material regions disposed between adjacent discrete devices in the linear sequence, separating adjacent discrete devices. At least one electrical conductor is disposed within the device fiber body along at least a portion of the device fiber body length. The electrical conductor is disposed in electrical connection with an electrical contact pad of discrete devices within the device fiber body.