Patent classifications
H01B1/026
Method of forming a solder bump structure
A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.
COPPER ALLOY WIRE, COPPER ALLOY STRANDED WIRE, ELECTRIC WIRE, TERMINAL-FITTED ELECTRIC WIRE, AND METHOD OF MANUFACTURING COPPER ALLOY WIRE
Provided are: a copper alloy wire having an excellent electrical conductivity, a high strength, and an excellent elongation; a copper alloy stranded wire including the copper alloy wire; an electric wire including the copper alloy wire or the copper alloy stranded wire as a conductor; a terminal-fitted electric wire including the aforementioned electric wire; and a method of manufacturing a copper alloy wire. The copper alloy wire has a composition including: not less than 0.2% by mass and not more than 1% by mass of Mg; not less than 0.02% by mass and not more than 0.1% by mass of P; and the balance including Cu and inevitable impurities. The copper alloy wire has an electrical conductivity of not less than 60% IACS, a tensile strength of not less than 400 MPa, and an elongation at breakage of not less than 5%.
COPPER ALLOY STRIP EXHIBITING IMPROVED DIMENSIONAL ACCURACY AFTER PRESS-WORKING
Provided is a Corson alloy having improved bending workability and also having high dimensional accuracy after press-working. A copper alloy strip which is a rolling material, the rolling material containing from 0 to 5.0% by mass of Ni or from 0 to 2.5% by mass of Co, the total amount of Ni+Co being from 0.2 to 5% by mass; from 0.2 to 1.5% by mass of Si, the balance being copper and unavoidable impurities, wherein the rolling material has a surface satisfying the relationship: 1.0I.sub.(200)/I.sub.0(200)5.0; wherein an area ratio of Cube orientation {100} <001> is from 2 to 10% in EBSD measurement of a rolling parallel cross section; and wherein a ratio: (an average crystal grain size of Cube orientation {100} <001> of the rolling parallel cross section)/(an average crystal grain size of the rolling parallel cross section) is from 0.75 to 1.5.
COPPER ALLOY STRIP EXHIBITING IMPROVED DIMENSIONAL ACCURACY AFTER PRESS-WORKING
Provided is a Corson alloy having improved bending workability and also having high dimensional accuracy after press-working. A copper alloy strip which is a rolling material, the rolling material containing from 0 to 5.0% by mass of Ni or from 0 to 2.5% by mass of Co, the total amount of Ni+Co being from 0.2 to 5% by mass; from 0.2 to 1.5% by mass of Si, the balance being copper and unavoidable impurities, wherein the rolling material satisfies the relationship: A.sup.0/A1.000, in which A.sup.0 represents a projected area of an indentation remaining after carrying out a Vickers hardness test by maintaining a square pyramidal indenter for 10 seconds while applying a test force with a load of 1 kg to a surface of a base material and releasing the test force; and A represents an area connecting vertices of the indenter, and wherein the rolling material satisfies the relationship: 0.1I.sub.(200)/I.sub.0(200)<1.0, in which I.sub.(200) represents an X-ray diffraction intensity from a (200) plane on the surface, and I.sub.0(200) represents an X-ray diffraction intensity from a (200) plane of a pure copper powder standard sample.
ELECTRICAL CONTACT ALLOY FOR VACUUM CONTACTORS
An improved electrical contact alloy, useful for example, in vacuum interrupters used in vacuum contactors is provided. The contact alloy according to the disclosed concept comprises copper particles and chromium particles present in a ratio of copper to chromium particles of 2:3 to 20:1 by weight. The electrical contact alloy also comprises particles of a carbide, which reduces the weld break strength of the electrical contact alloy without reducing its interruption performance.
CABLES EXHIBITING INCREASED AMPACITY DUE TO LOWER TEMPERATURE COEFFICIENT OF RESISTANCE
Cables including conductors formed form ultra-conductive copper wires which have a lower temperature coefficient of resistance are disclosed. Methods of making the cables including conductors with ultra-conductive copper wires are further disclosed.
Power inductor
A power inductor includes a core and winding. The winding has at least two portions, one made of pure copper and the other made of a low-TCR (temperature coefficient of resistance) alloy, wherein the alloy portion is used to form a current sensor. The two portions are joined to provide a unitary winding. The inductor can provide accurate current detection sensor while minimizing total resistance of the winding.
Chip resistor and paste for forming resist layer of chip resistor
A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.
Multi-core cable for vehicle
A multi-core cable for vehicle includes two power wires, two signal wires, two electric wires, and a sheath. The two power wires have the same size and are made of the same material. The two signal wires have the same size and are made of the same material, and a pair of the two signal wires is twisted and is configured a twisted pair of signal wires. The two electric wires have the same size and are made of the same material, and a pair of the electric wires is twisted and is configured as a twisted pair of electric wires. The two power wires, the twisted pair of signal wires and the twisted pair of electric wires are stranded.
CONNECTION STRUCTURE
In a connection structure of the present disclosure, compression of a first connecting part of a first conductor forming a connecting component causes the first connecting part to be directly coupled to a second connecting part of a second conductor forming a body to be connected, to form an electrical connection structure, wherein the first conductor is made of copper or a copper alloy; and the second conductor has a Vickers hardness HV1 of 110 or more as measured at a position of the second connecting part in a state where the electrical connection structure is formed, and a Vickers hardness HV2 of 80% or more of the Vickers hardness HV1, the Vickers hardness HV2 being measured at a position of the second conductor which does not form the electrical connection structure.