A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.

A composite material is provided having functionalized carbon nanotubes and a metal matrix. It is obtained by a process including dispersing functionalized carbon nanotubes or a mixture of functionalized carbon nanotubes and of at least one metal, in an open-pore or semi-open-pore metal foam, in order to form a composite structure, and compacting the composite structure obtained in the preceding stage in order to form the composite material in the form of a solid mass.

An electrically conductive wire includes a core wire made of metal, and a coating layer made of stainless steel covering a surface of the core wire. The metal constituting the core wire has an electrical conductivity greater than that of the stainless steel. The core wire includes a diffusion layer containing not less than 0.5 mass % Fe, arranged to constitute the surface of the core wire. The diffusion layer has a thickness that is not less than 0.4% and not more than 5% of the diameter of the core wire.

A method and composition for doped HTS tapes having directional flux pinning and critical current.

This copper alloy wire is a copper alloy wire which is made of a precipitation hardening-type copper alloy containing Co, P, and Sn and is manufactured using a continuous cast-rolling method or cold working of a continuous cast wire rod manufactured using a continuous casting method, in which the copper alloy wire has a composition including Co: more than or equal to 0.20 mass % and less than or equal to 0.35 mass %, P: more than 0.095 mass % and less than or equal to 0.15 mass %, and Sn: more than or equal to 0.01 mass % and less than or equal to 0.5 mass % with a balance being Cu and inevitable impurities.

A copper alloy wire rod having an alloy composition containing 0.5 to 6.0% by mass of Ag, 0 to 1.0% by mass of Mg, 0 to 1.0% by mass of Cr, and 0 to 1.0% by mass of Zr, with the balance being Cu and inevitable impurities, wherein an average closest particle distance of second phase particles having a particle size of 200 nm or less is 580 nm or less in a cross section perpendicular to a longitudinal direction of the wire rod.

A rotor shaft for a high speed motor that has a coating that is secured to a shaft body. The coating and the shaft body are formed from dissimilar materials. More specifically, the coating may be an alloy material, such as, for example, a copper alloy, while the shaft body may be a steel material. According to certain embodiments, the alloy material of the coating may be secured to at least a portion of a rotor body blank in a solution treated condition via a low temperature welding procedure. Additionally, the coating may be hardened, such as for example, through the use of an age hardening process. The coating and the rotor body blank may be machined together to form the rotor shaft. According to certain embodiments, such machining may configure the rotor shaft for use with a turbo-compressor that is configured for air compression.

The invention is a precipitation-strengthened copper alloy, including the following components in percentage by weight: 80 wt %-95 wt % of Cu, 0.05 wt %-4.0 wt % of Sn, 0.01 wt %-3.0 wt % of Ni, 0.01 wt %-1.0 wt % of Si, and the balance of Zn and unavoidable impurities. According to the invention, the comprehensive performance of the alloy is improved by solution strengthening and precipitation strengthening; while the strength of the matrix is improved, the electrical conductivity of the alloy is hardly affected, the bending workability meets the requirements, and the stress relaxation resistance comparable to that of tin phosphor bronze is achieved. The comprehensive performance of the alloy of the invention is superior to that of the tin phosphor bronze C51900. Furthermore, the alloy of the invention is low in raw material cost, has obvious advantages in welding and plating.

One object of the present invention is to provide fine copper particles which are less likely to be deteriorated by oxidation in the atmosphere without being coated with an antioxidant or the like and which can be sintered at a lower temperature. The present invention provides fine copper particles wherein an entire surface is covered with a coating film containing cuprous oxide and having an average film thickness of 1.5 nm or less.

Bendability of a copper alloy wire is improved without decrease in an electrical conductivity of the copper alloy wire made of copper alloy containing zirconium. A cable includes: a two-core stranded wire formed by intertwining two electrical wires made of a conductor and an insulating layer covering the conductor; a filler formed around the two-core stranded wire; and a sheath formed around the filler and the electrical wire. The conductor is a copper alloy wire in which a precipitate containing the zirconium disperses, and has a crystal gain diameter that is equal to or smaller than 1 m, an electrical conductivity that is equal to or higher than 87% IACS, and a tensile stress that is equal to or larger than 545 MPa.