A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0([Co]0.007)/([P]0.008)6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.

The present disclosure relates to a hybrid cable having a jacket with a central portion positioned between left and right portions. The central portion contains at least one optical fiber and the left and right portions contain electrical conductors. The left and right portions can be manually torn from the central portion.

An electrical train messenger wire and a catenary system for an electrical train including the electrical train messenger wire. The messenger wire includes a fiber-reinforced composite strength member and a conductive layer surrounding the fiber-reinforced composite strength member, where the conductive layer is fabricated from copper or a copper alloy. The fiber-reinforced strength member advantageously has a high tensile strength, thereby reducing the sag of a contact wire supported by the messenger wire. The catenary system employing the messenger wire may facilitate faster train speeds and may obviate the need for cantilever systems such as balanced weight anchors to maintain tension in the contact wire.

The composition of a copper alloy is as follows: Sn: 3.0-6.5%; Ni: 0.30-0.70%; P: 0.15-0.40%; S: 0.10-0.40%; Zn: optionally up to 0.20%; Fe: optionally up to 0.50%; Mn: optionally up to 0.50%; Pb: optionally up to 0.25%, with the balance being copper and unavoidable impurities. The ratio of fraction of Ni to fraction of P is at least 1.1 and at most 2.8, and the alloy include nickel phosphides.

This copper alloy for an electronic/electric device includes Mg at an amount of 3.3 atom % to 6.9 atom % with a remainder substantially being Cu and inevitable impurities, wherein a strength ratio TS.sub.TD/TS.sub.LD is more than 1.02, and the strength ratio TS.sub.TD/TS.sub.LD is calculated from a strength TS.sub.TD measured by a tensile test carried out in a direction perpendicular to a rolling direction and a strength TS.sub.LD measured by a tensile test carried out in a direction parallel to the rolling direction.

A free grounding film and a manufacturing method therefor, and a shielding circuit board including the free grounding film and a grounding method. The free grounding film includes at least one conductor layer. The shielding circuit board including the free grounding film is formed in a manner that an electromagnetic wave shielding film is arranged on a printed circuit board, and the upper surface of the electromagnetic wave shielding film is provided with the free grounding film. The grounding method for the shielding circuit board adopts one of three modes.

A high-strength and high-conductivity copper alloy and applications of the alloy as a material of a contact line of a high-speed railway allowing a speed higher than 400 kilometers per hour. The copper alloy has the following characteristics: (1) constituents of the copper alloy are in the form of CuXY, X is one or more selected from Ag, Nb and Ta, and Y is one of more selected from Cr, Zr and Si; (2) at a room temperature, the element X in the copper alloy exists in the form of a pure phase and solid solution atoms, the element Y exists in the form of a pure phase and solid solution atoms or a CuY compound and solid solution atoms, the content of the element X existing in the form of the solid solution atoms is lower than 0.5%, and the content of the element Y existing in the form of the solid solution atoms is lower than 0.1%; and (3) the copper alloy exists in the form of long strip rods or lines, the element X in the form of the pure phase is embedded in the copper alloy in the form of fibers disposed in parallel approximately, and the axial direction of the fibers is approximately in parallel with the axial direction of the copper alloy rods or lines; and the element Y existing in the copper alloy in the form of the pure phase or the CuY compound is embedded in the copper alloy in the form of particles. The copper alloy is suitable for being used as a material of a contact line of a high-speed railway allowing a speed higher than 400 kilometers per hour.

A copper alloy for electronic devices has a low Young's modulus, high proof stress, high electrical conductivity and excellent bending formability and is appropriate for a component for electronic devices including a terminal, a connector, a relay and a lead frame. Also a method of manufacturing a copper alloy utilizes a copper alloy plastic working material for electronic devices, and a component for electronic devices. The copper alloy includes Mg at 3.3 to 6.9 at %, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is X at %, an electrical conductivity (% IACS) is in a range of {1.7241/(0.0347X.sup.2+0.6569X+1.7)}100, and an average grain size is in a range of 1 m-100 m. In addition, an average grain size of a copper material after an intermediate heat treatment and before finishing working is in a range of 1 m-100 m.

A stranded wire conductor includes a plurality of copper-based element wires which are twisted together, and is subjected to circular compression and then heat treatment. The copper-based element wires have a Ni-based plated layer on the surface. The stranded wire conductor preferably has a conductor cross-sectional area of 0.25 mm.sup.2 or less. An insulated wire includes the stranded wire conductor, and an insulator that coats the outer circumference of the stranded wire conductor.

An electronic assembly has an electronic module and an electric part. The electronic module has an electric terminal having a press-fit section. The press-fit section includes at least one of the following CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg. The electric part has a contact hole. The electronic assembly includes a press-fit connection between the press-fit section and the electric part. In that press-fit connection, the press-fit section both mechanically and electrically contacts the electric part.