A stranded electrical conductor includes a single center strand in aluminum or aluminum alloy (10, 20, 30, 40A, 50A) and a plurality of conductor strands (11, 21, 31, 41, 51) arranged in at least one layer around said center strand. The relation between the diameter of said center strand in aluminum or aluminum alloy and the diameter of said peripheral conductor strands is greater than or equal to 3.

There is provided an electrically conductive substrate including a transparent base, and a copper layer formed on at least one surface of the transparent base, wherein the copper layer is such that, when a film thickness of the copper layer is 0.5 m, a surface resistance value is less than or equal to 0.07/.

A method for manufacturing a copper composite electrode, including contacting a conductive substrate including copper with a phosphate solution for oxidation to produce a copper phosphate structure on a surface of the conductive substrate, thus acquiring a copper phosphate composite electrode.

According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a composition including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.

A composite wire includes a metal inner core, an easily-passivated metal layer wrapping a surface of the metal inner core, and a self-adhesive resin layer wrapping a surface of the easily-passivated metal layer. An insulation layer of the composite wire is a metal passivation layer that is formed by the easily-passivated metal layer obtained after sintering treatment and oxidation. The preparation method is used for manufacturing the composite wire. The method for preparing a power inductor is used for preparing a new type of power inductor including the composite wire. The composite wire is high-temperature resistant and is easily wound. During winding, the easily-passivated metal layer is unlikely to fall off, thereby ensuring that the insulation layer formed by passivation of the easily-passivated metal layer has desirable weather resistance and voltage resistance.

An object of the present invention is to provide an ultrafine copper alloy being high in strength and conductivity and being also superior in elongation, a copper alloy stranded wire, a covered electric wire including the copper alloy wire or copper alloy stranded wire, and a terminal-fitted electric wire. A copper alloy wire used as a conductor, the copper alloy wire containing greater than or equal to 0.4% by mass and less than or equal to 1.5% by mass of Fe, greater than or equal to 0.1% by mass and less than or equal to 1.0% by mass of Ti, and the remainder including Cu and an impurity.

Metal nanowires with high linearity can be produced using metal salts at a relatively low temperature. A transparent conductive film can be formed using the metal nanowires. Particularly, the transparent conductive film has high transmittance, low sheet resistance, and good thermal, chemical and mechanical stability. The transparent conductive film has a high electrical conductivity due to the high linearity of the metal nanowires. The metal nanowires take up 5% or less of the volume of the transparent conductive film, ensuring high transmittance of the transparent conductive film. Furthermore, the metal nanowires are useful as replacements for existing conductive materials, such as ITO, conductive polymers, carbon nanotubes and graphene. The metal nanowires can be applied to flexible substrates and other various substrates due to their good adhesion and high applicability to the substrates. Moreover, the metal nanowires can find application in various fields, such as displays and solar cell devices.

The present invention relates to a Ti-included oxide dispersion strengthened copper alloy and a method for preparing oxide dispersion copper by an internal oxidation Ti-included copper alloy, which thus allows spheronization and refinement of the oxides, and reduction of distance between the oxides. According to the present invention, there is provided oxide dispersion copper having excellent hardness and tensile strength as well as electrical conductivity by performing spheronization and refinement for Ti-included oxide and thus further reducing the distance between oxides.

A connecting structure of a crimp terminal and an electric wire includes an electric wire including a conductor, an insulating coating covering the conductor, and a conductor exposed part where the conductor is exposed by removing the coating on an end part of the electric wire; a crimp terminal made of a metal material different from that of the conductor and includes an electric wire connector including a conductor crimping portion that crimps the conductor exposed part of the end part of the electric wire and a coating crimping portion that crimps a part of the coating left in the end part of the electric wire; and an intermediate potential film deposited by spraying a metal having a potential different from that of the metal material of the crimp terminal on an outer periphery of the electric wire connector being crimped to the end part of the electric wire.

An electric contact material for a connector includes a base material made of a metal material; an alloy layer that is formed on the base material and made of an alloy containing at least three elements including Sn and Cu as well as at least one metal selected from Zn, Co, Ni, and Pd; and a conductive coating layer formed on the surface of the alloy layer. The alloy layer contains an intermetallic compound obtained by replacing some of the Cu atoms in Cu.sub.6Sn.sub.5 with at least one metal selected from Zn, Co, Ni, and Pd. It is preferable that the content of at least one metal selected from Zn, Co, Ni, and Pd in the alloy layer is in a range of 1 to 50 atom % when the total content of the metal and Cu is regarded as 100 atom %.