H01B1/026

Aluminum coated copper bond wire and method of making the same

A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 m. The wire has a diameter in the range of from 100 m to 600 m and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.

NANOCABLE AND MANUFACTURING METHOD THEREOF
20180122529 · 2018-05-03 ·

A nanocable in which the thickness of a core including a wire of first conductor is reduced and a layer of second conductor containing carbon nanotube is introduced, thereby achieving a cable having an ultrafine wire diameter and preventing current intensity from decreasing due to an increase in resistance because of the ultrafine wire diameter. The nanocable is configured such that a polymer layer (an insulating layer) is interposed between the core including a wire of first conductor and the layer of second conductor, thus preventing current intensity from decreasing due to an increase in resistance attributable to the ultrafine wire diameter while ensuring a cable having an external diameter ranging from ones of m to hundreds of m and having a nano-sized core diameter, whereby the nanocable can be utilized in medical instruments such as endoscopic tools.

Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material

The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.

Superconducting cable

A superconducting cable includes a core part, in which the core part includes a former including a plurality of copper wires, a superconducting conductor layer including a plurality of superconducting wires connected in parallel to each other, an insulating layer, and a superconducting shield layer including a plurality of superconducting wires are sequentially arranged. A conducting layer formed of a metal having a current-carrying property at room temperature is provided on opposite surfaces of each of the superconducting wires of the superconducting conductor layer to reinforce mechanical rigidity of each of superconducting wires of the superconducting conductor layer, and the former has a cross-sectional area which is smaller than that of a former of a superconducting cable in which the conducting layer is not added to superconducting wires and which is designed on an assumption that all fault current flows to the former.

CONDUCTIVE JOINT ARTICLE AND METHOD FOR MANUFACTURING SAME

It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390 C. or less. And, connection resistance between the joined members exhibits less than 110.sup.5 /mm.sup.2.

COPPER POWDER, COPPER PASTE USING SAME, CONDUCTIVE COATING MATERIAL, CONDUCTIVE SHEET, AND METHOD FOR PRODUCING COPPER POWDER
20180111190 · 2018-04-26 ·

Provided is a copper powder which can be suitably utilized in applications such as an electrically conductive paste and an electromagnetic wave shield. A copper powder according to the present invention has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic SEM observation gather, the average particle diameter D50 of the copper powder is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.

ELECTRIC MOTOR ELEMENT, ELECTRIC MOTOR, AND DEVICE

An electric motor element according to the present invention includes a rotor. The rotor includes a rotor core constituted by a plurality of punched steel sheets laminated in a rotational shaft direction, magnet positioning holes penetrating the rotor core, and a bonded magnet portion constituting a permanent magnet. The magnet positioning holes are filled with the bonded magnet portion. A length of the rotor core in the rotational shaft direction is larger than a length of a stator core in the rotational shaft direction. The bonded magnet portion is shaped such that a position of the bonded magnet portion, the position being located between both axial ends of the rotor and in a plane facing the stator core, is closer to a rotation shaft holding the rotor, than to a position of the bonded magnet portion, the position being located at one of the axial ends of the rotor in the rotational shaft direction and in the plane facing the stator core.

Multi-layer preform sheet
09950496 · 2018-04-24 · ·

A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300 C. or above, and a second metal capable of forming an intermetallic compound with the first metal.

Conductive component and electronic device including the same

A conductive component including: a substrate, a first layer comprising a plurality of island structures disposed on the substrate, wherein the island structures include graphene; and a second layer disposed on the first layer, wherein the second layer includes a plurality of conductive nanowires. Also, an electronic device including the conductive component.

Electrical wire with a central aluminum wire surrounded by at least one copper wire
09953737 · 2018-04-24 ·

An electrical wire comprises a central Aluminum wire, wherein the central Aluminum wire is surrounded by at least one Copper wire and the aluminum wire and the copper wire are uncoated such that the Copper wire is in direct contact with the central Aluminum wire. 3-23% by volume of the electrical wire is made of Aluminum and the rest is made of Copper. At least one of the central wire and the surrounding wire has a purity of at least 95% to provide a high degree of contact between Aluminum and Copper.