Clamps and methods disclosed herein can help to provide efficient electrical communication between a first conductor and a second conductor. An example clamp includes a main housing portion that includes a first surface, a second surface, a body, and an insert, the insert providing electrical communication between the first surface and the second surface; a clamp member; and a fastener.

Disclosed herein is a flexible conductive substrate. According to the present invention, the flexible conductive substrate comprises a fabric substrate, a first film formed of metal or metal oxide on the fabric substrate, a second film formed of ITO film including tin oxide on the first film, and a third film formed of ITO film including tin oxide on the second film. A content of tin oxide included in the second film is smaller than that of oxide included in the third film.

The present invention relates to a method for modifying the surface of a substrate made of electrically conductive metal oxide and notably made of ITO, comprising the following steps consisting in: (i) bringing into contact said surface with a solution containing copper ions (Cu.sup.2+) and ammonia then washing and optionally drying the surface thus obtained; and (ii) bringing into contact the surface obtained following step (i) with a solution containing sodium tetraborohydride then washing and optionally drying the surface of said conductive metal oxide substrate. The present invention relates to the use of such a method within the scope of the metallisation by copper of a conductive metal oxide substrate as well as the surfaces of a modified and metallised conductive metal oxide substrate thus obtained.

Provided are an insulated wire material including: a conductor including a single core conductor or a plurality of divided conductors placed in parallel to each other or helically placed; a peripheral insulating layer with which a periphery of the conductor is coated; and a welding member provided at least one end portion of the conductor and joined, via a welded portion welded to the single core conductor or divided conductors, to at least a peripheral surface of the welded portion, a manufacturing method thereof, a coil including the insulated wire material, and electrical/electronic equipment including the coil.

Noble metal-coated nanostructures and related methods are disclosed. According to an aspect, a nanostructure may include a structure comprising a base metal. As an example, the structure may be a nanowire. In a more specific example, the structure may be a copper nanowire or a nanowire made of a base metal such as nickel, tin, indium, zinc, the like, or combinations thereof. The base metal structure may be coated with a noble metal that conformally covers the base metal structure. Example noble metals include, but are not limited to, ruthenium, rhodium, palladium, silver, iridium, platinum, and gold. The coating may be made of one or more of the noble metals along with other materials.

An electrical wire and an electrical wire with a terminal capable of diminishing the adjustment of a crimping height. There is provided an electrical wire 1 including a conductor part 11 that is made of a precipitation strengthened copper alloy having a cross-sectional area of 0.13 sq in the ISO 6722 standard and is compressed, wherein the conductor part 11 has a rate of elongation of 7% or more, and a tensile strength of 500 MPa or more. In addition, the electrical conductivity of the conductor part is 70% IACS or more.

There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 μm by 136 μm in accordance with JIS B 0601-2001.

Twisted pair cables incorporated separators with cooling channels are described. A cable may include a plurality of twisted pairs of individually insulated electrical conductors, and a separator extending lengthwise along a longitudinal length of the cable may be positioned between at least two of the plurality of twisted pairs. The separator may include a flexible body configured to maintain the at least two pairs in a predetermined configuration. A first channel extending lengthwise may define a longitudinal cavity through the separator, and at least one second channel may extend from the first channel through the flexible body to an outer surface of the separator. Additionally, the cable may include a jacket formed around the plurality of twisted pairs and the separator.

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

The present disclosure relates generally to wires and more particularly to textured powder wires containing nanoscale metallic silver powder. The invention presents an improvement of the process of making compressed cores of textured-powder high-temperature superconductor previously using the micaceous high-temperature superconductor Bi-2212. Embodiments of the claimed methods are useful with the micaceous high-temperature superconductors, notably Bi2Sr2CaCu208+x (Bi-2212) and Bi2S-r2Ca2Cu3O10+x (Bi-2223) and rare earth barium copper oxide (REBCO).