Provided are a conductive composite, and a method of manufacturing the conductive composite, the composite comprising nonconductive hollow microspheres and conductive filler which are dispersed in a matrix. The nonconductive hollow microspheres and the conductive filler comprised in the conductive composite may be expanded or deformed by pressurization or thermal treatment.

The present invention relates to a method for manufacturing a nanowire of a core-shell structure including a metal nanowire core and a graphene shell, comprising the steps of: providing a metal nanowire; and coating the metal nanowire with graphene by a plasma chemical vapor deposition method. In addition, the present invention relates to: a nanowire having a core-shell structure including a metal nanowire core and a graphene shell; and a transparent electrode formed from the nanowire. The transparent electrode formed from the nanowire having a core-shell structure has advantages of having controllable copper oxidation characteristics, being optically, electrically and mechanically excellent, and enabling the transparent electrode to be manufactured at a low cost.

A data cable assembly and a power cable assembly. The data cable assembly including a first power cable and a first ground cable each including a plurality of cladded wires. The data cable assembly further including an data transmission cable and, in some instances, a clocking cable. The data transmission cable can be an active optical cable including, at each of its ends, an electrical-optical configured to covert received electrical signals to optical signals and convert received optical signals to electrical signals. The power cable assembly including a first, second, and third high power cable and a first, second, and third high power grounding cable, where each of the cables of the power cable assembly includes a plurality of cladded wires.

A vehicle cable capable of transmitting a signal of 4 GHz or higher includes a two-core cable, a general shield layer that has a braided structure and is disposed on an outer periphery of the two-core cable, and an outer sheath disposed on an outer periphery of the general shield layer. The two-core cable includes two conductors that are a pair of stranded wires arranged in parallel to each other, an insulation layer configured to bundle and cover the two conductors, and a first shield layer including a first metal foil that is disposed on an outer periphery of the insulation layer.

A hermetic terminal includes a metal outer ring made of a low resistance conductor having a through hole, a lead made of a low resistance conductor inserted in the through hole of the metal outer ring, and an insulating material made of high expansion glass for sealing the metal outer ring and the lead.

To provide a metal particle composition having excellent oxidation resistance, which does not require a transition metal catalyst and can be applied to existing metal particles, a method for producing the metal particle composition, and a paste. The metal particle composition contains, with respect to 100 parts by mass of metal particles, 0.1 to 5 parts by mass of a compound (A) having a structure represented by the following general formula (I): ##STR00001## in which R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, or an aralkyl group, R.sup.3 and R.sup.4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group, an alkenyl group having 2 to 6 carbon atoms, an alkenyloxy group, an aryl group, or an aralkyl group.

A device for damping of high frequency currents is provided. The device includes a conductor extending along a main axis, a first damping path including a first damping element extending along a first axis and a second damping path including a second damping element extending along a second axis. The first and second damping elements are arranged on opposite sides of the conductor. The main axis, the first axis and the second axis are different and separate from each other. The first damping element and the second damping element are spaced apart from the conductor and electrically connected in parallel with the conductor between a first position and a second position along the conductor. Further, from the first position to the second position, a resistance of the conductor is lower than a resistance of either one of the first and second damping paths.

Disclosed is a beryllium-free copper alloy having high strength, high electric conductivity and good bending workability and a method of manufacturing the copper alloy. Provided is a copper alloy having a composition represented by the composition formula by atom %: Cu100-a-b-c(Zr, Hf)a(Cr, Ni, Mn, Ta)b(Ti, Al)c [wherein 2.5a4.0, 0.1<b1.5 and 0c0.2; (Zr, Hf) means one or both of Zr and Hf; (Cr, Ni, Mn, Ta) means one or more of Cr, Ni, Mn and Ta; and (Ti, Al) means one or both of Ti and Al], and having Cu primary phases in which the mean secondary dendrite arm spacing is 2 m or less and eutectic matrices in which the lamellar spacing between a metastable Cu5(Zr, Hf) compound phase and a Cu phase is 0.2 m or less.

The present invention provides a method and an apparatus for forming an oriented nanowire material as well as a method for forming a conductive structure, which can be used to solve the problem of imperfect process for forming oriented nanowire material in prior art. The method for forming an oriented nanowire material of the present invention comprises: forming a liquid film in a closed frame by a dispersion containing nanowires; expanding the closed frame in a first direction so that the liquid film expands in the first direction along with the closed frame; contracting the closed frame in the first direction so that the liquid film contracts in the first direction along with the closed frame; transferring the contracted liquid film to a substrate; and curing the liquid film to form an oriented nanowire material on the substrate.

To provide a copper powder exhibiting a high electric conductivity suitable for a metallic filler used in an electrically conductive paste, a resin for electromagnetic shielding, an antistatic coating, etc., and having excellent uniform dispersibility required for forming a paste so as to inhibit an increase in viscosity due to flocculation. This copper powder 1 forms a branch shape having a plurality of branches through the conglomeration of copper particles 2. The copper particles 2 have a spheroidal shape, with diameters ranging from 0.2 m-0.5 m, inclusive, and lengths ranging from 0.5 m-2.0 m, inclusive. The average particle diameter (D50) of the copper powder 1 in which the spheroidal copper particles 2 have conglomerated is 5.0 m-20 m. By mixing this tree-branch-shaped copper powder 1 into a resin, it is possible to produce an electrically conductive paste, etc., exhibiting excellent electric conductivity, for example.