H01B1/16

ELECTRICALLY CONDUCTIVE AND WEATHERPROOF ENCLOSURE
20220021172 · 2022-01-20 ·

In accordance with 37 C.F.R. § 1.121(b)(2)(i), please replace the abstract of the specification as filed with the following paragraph:

A method of making an electrically conductive and weatherproof enclosure includes mixing and melting an electrically conductive material, a latex rubber material, and a polycarbonate material to produce a weatherproof material mixture, blending carbon black with polyethylene to produce an electrically conductive additive, positioning an injection mold of the enclosure in fluid communication with an exit end of a heating barrel, injecting the weatherproof material mixture into an entry end of the heating barrel, introducing the electrically conductive additive through a lateral port of the heating barrel proximate to the exit end to partially mix with the weatherproof material mixture to produce an injection mixture, and injecting the injection mixture into the injection mold to produce the electrically conductive and weatherproof enclosure.

Conductive composition and method for producing terminal electrode

A conductive composition has excellent adhesiveness and conductivity. A conductive composition contains copper powder, cuprous oxide, a lead-free glass frit, and an acid-based additive. The lead-free glass frit is contained in an amount of 9 to 50 parts by mass relative to 100 parts of the copper powder. The lead-free glass frit contains a borosilicate zinc-based glass frit and a vanadium zinc-based glass frit. The borosilicate zinc-based glass frit contains boron oxide, silicon oxide, zinc oxide, and optional other components, among which boron oxide, silicon oxide, and zinc oxide serve as top-three oxide components in terms of content. The vanadium zinc-based glass frit contains vanadium oxide, zinc oxide, and optional other components, among which vanadium oxide and zinc oxide serve as top-two oxide components in terms of content. The acid-based additive is contained 0.1 to 5.0 parts by mass relative to 100 parts of the copper powder.

Conductive composition and method for producing terminal electrode

A conductive composition has excellent adhesiveness and conductivity. A conductive composition contains copper powder, cuprous oxide, a lead-free glass frit, and an acid-based additive. The lead-free glass frit is contained in an amount of 9 to 50 parts by mass relative to 100 parts of the copper powder. The lead-free glass frit contains a borosilicate zinc-based glass frit and a vanadium zinc-based glass frit. The borosilicate zinc-based glass frit contains boron oxide, silicon oxide, zinc oxide, and optional other components, among which boron oxide, silicon oxide, and zinc oxide serve as top-three oxide components in terms of content. The vanadium zinc-based glass frit contains vanadium oxide, zinc oxide, and optional other components, among which vanadium oxide and zinc oxide serve as top-two oxide components in terms of content. The acid-based additive is contained 0.1 to 5.0 parts by mass relative to 100 parts of the copper powder.

Deformable conductors and related sensors, antennas and multiplexed systems
11222735 · 2022-01-11 · ·

A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt %) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt % of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition. Also disclosed are sensors and multiplexed systems utilizing deformable conductors.

Deformable conductors and related sensors, antennas and multiplexed systems
11222735 · 2022-01-11 · ·

A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt %) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt % of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition. Also disclosed are sensors and multiplexed systems utilizing deformable conductors.

EASILY-CRUSHABLE COPPER POWDER AND MANUFACTURING METHOD THEREFOR
20210346950 · 2021-11-11 ·

Provided is a copper powder manufactured by means of a wet method, wherein the absolute value of the zeta potential of the copper powder is at least 20 mV. The copper powder can be manufactured so as to reduce the burden of the steps of crushing a dry cake and classification, and there is a sufficient reduction in residual secondary particles.

Conductive composition, method for producing conductor, and method for forming wire of electronic component

A conductive composition has excellent adhesiveness to a substrate and conductivity. For example, a conductive composition contains copper powder, cuprous oxide, a lead-free glass frit, and a carboxylic acid-based additive. The cuprous oxide is contained in an amount of at least 5.5 parts by mass and up to 25 parts by mass relative to 100 parts by mass of the copper powder. The lead-free glass frit contains a borosilicate zinc-based glass frit and a vanadium zinc-based glass frit. The borosilicate zinc-based glass frit contains boron oxide, silicon oxide, zinc oxide, and optional other components, among which boron oxide, silicon oxide, and zinc oxide serve as top-three oxide components in terms of content. The vanadium zinc-based glass frit contains vanadium oxide, zinc oxide, and optional other components, among which vanadium oxide and zinc oxide serve as top-two oxide components in terms of content.

Conductive composition, method for producing conductor, and method for forming wire of electronic component

A conductive composition has excellent adhesiveness to a substrate and conductivity. For example, a conductive composition contains copper powder, cuprous oxide, a lead-free glass frit, and a carboxylic acid-based additive. The cuprous oxide is contained in an amount of at least 5.5 parts by mass and up to 25 parts by mass relative to 100 parts by mass of the copper powder. The lead-free glass frit contains a borosilicate zinc-based glass frit and a vanadium zinc-based glass frit. The borosilicate zinc-based glass frit contains boron oxide, silicon oxide, zinc oxide, and optional other components, among which boron oxide, silicon oxide, and zinc oxide serve as top-three oxide components in terms of content. The vanadium zinc-based glass frit contains vanadium oxide, zinc oxide, and optional other components, among which vanadium oxide and zinc oxide serve as top-two oxide components in terms of content.

Open-shell conjugated polymer conductors, composites, and compositions

The invention provides for polymer structures and their preparation and resulting novel functionalities including open-shell character and high intrinsic conductivity with wide-range tenability. Electrical conductivity can be further modulated by introducing or blending with materials, fillers, dopants, and/or additives. The materials or resultant composites of the invention can be processed by various techniques into different forms to realize multiple applications.

Open-shell conjugated polymer conductors, composites, and compositions

The invention provides for polymer structures and their preparation and resulting novel functionalities including open-shell character and high intrinsic conductivity with wide-range tenability. Electrical conductivity can be further modulated by introducing or blending with materials, fillers, dopants, and/or additives. The materials or resultant composites of the invention can be processed by various techniques into different forms to realize multiple applications.