There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

Disclosed are a method of uniformly dispersing nickel-plated conductive particles of a single layer within a polymer film by applying a magnetic field to the polymer film and a method of fabricating an anisotropic conductive film using the same. The method of fabricating a film may include forming a liquefied polymer layer by roll-to-roll coating a polymer solution in which a plurality of conductive particles has been mixed, dispersing the plurality of conductive particles included in the liquefied polymer layer by applying a magnetic field to the liquefied polymer layer, and fabricating a solid polymer layer limiting a movement of the plurality of dispersed conductive particles by drying the liquefied polymer layer in which the plurality of conductive particles has been dispersed.

Disclosed are a method of uniformly dispersing nickel-plated conductive particles of a single layer within a polymer film by applying a magnetic field to the polymer film and a method of fabricating an anisotropic conductive film using the same. The method of fabricating a film may include forming a liquefied polymer layer by roll-to-roll coating a polymer solution in which a plurality of conductive particles has been mixed, dispersing the plurality of conductive particles included in the liquefied polymer layer by applying a magnetic field to the liquefied polymer layer, and fabricating a solid polymer layer limiting a movement of the plurality of dispersed conductive particles by drying the liquefied polymer layer in which the plurality of conductive particles has been dispersed.

A bioelectrode includes a conductive rubber electrode and a silver coating layer provided on the conductive rubber electrode and containing a silicone rubber and silver particles. The silver coating layer contains a modified silicone and contains ions for ion conduction among the silver particles.

A bioelectrode includes a conductive rubber electrode and a silver coating layer provided on the conductive rubber electrode and containing a silicone rubber and silver particles. The silver coating layer contains a modified silicone and contains ions for ion conduction among the silver particles.

A bioelectrode includes a conductive rubber electrode and a silver coating layer provided on the conductive rubber electrode and containing a silicone rubber and silver particles. The silver coating layer further contains a modified silicone.

A bioelectrode includes a conductive rubber electrode and a silver coating layer provided on the conductive rubber electrode and containing a silicone rubber and silver particles. The silver coating layer further contains a modified silicone.

The present disclosure discloses a ceramic glass powder and a solar cell metallization paste containing the ceramic glass powder, and belongs to the technical field of solar cells. The present disclosure provides a novel formula mode of a glass powder including a crystallization nucleus component and a glass network component, that is, a formula of a ceramic glass powder that has a special crystallization behavior, a low crystallinity before sintering and a high crystallinity after the sintering, and a conductive metallization paste containing the ceramic glass powder is further obtained. The present disclosure solves the technical problem that by using metallization pastes in the prior art, a balance between corrosion of a silicon wafer and an ohmic contact is difficult to achieve. The efficiency of a solar cell is improved.