Provided is a method for manufacturing a biological electrode capable of simply manufacturing a biological electrode in which an increase in resistance value over time due to strain is suppressed. The method for manufacturing a biological electrode includes a step of adding fumed silica to an aggregated silver powder to obtain a mixed silver powder and a step of forming a conductive rubber body containing a silicone rubber and the mixed silver powder.

A method of manufacturing a paste according to various embodiments of the present disclosure for resolving the above-described problems is disclosed. The method of manufacturing a paste may include an operation of adding a metal conductor and a multi-walled carbon nanotube (MWCNT) to chloroform (CHCl.sub.3) to produce a first mixture, an operation of adding polydimethylsiloxane (PDMS) to the first mixture to produce a second mixture, an operation of evaporating the chloroform in the second mixture to acquire a third mixture, and an operation of adding an additional additive to the third mixture to produce a paste.

A method of manufacturing a paste according to various embodiments of the present disclosure for resolving the above-described problems is disclosed. The method of manufacturing a paste may include an operation of adding a metal conductor and a multi-walled carbon nanotube (MWCNT) to chloroform (CHCl.sub.3) to produce a first mixture, an operation of adding polydimethylsiloxane (PDMS) to the first mixture to produce a second mixture, an operation of evaporating the chloroform in the second mixture to acquire a third mixture, and an operation of adding an additional additive to the third mixture to produce a paste.

The present disclosure discloses a low LOI tellurium-lithium-silicon-zirconium frit system and a conductive paste and application thereof, and belongs to the field of conductive paste. In the low LOI tellurium-lithium-silicon-zirconium frit system, components of the frit are 24%-40% TeO.sub.2, 18%-24% Li.sub.2O, 4%-13% SiO.sub.2, 0-2% ZrO.sub.2, and a balance MO.sub.x, and M is one or a mixture of Na, K, Mg, Ca, Sr, Ti, V, Cr, Mo, W, Mn, Cu, Ag, Zn, Cd, B, Al, Ga, Tl, Ge, Pb, P, and Bi. There is no need to add additional surfactants, a viscosity change of the conductive paste prepared after standing for 30 days is less than 20%, the conductive paste has good stability, the water related weight loss of inorganic oxide of the conductive paste is less than 1.6%, and the application performance of the conductive paste is not affected after standing for 30 days.

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

The present disclosure relates to a silver powder preparation method comprising: a silver powder preparation step of preparing a silver salt, which comprises silver ions, and then reducing the silver ion so as to precipitate silver particles; a silver powder recovery step of separating silver particles from an aqueous solution or a slurry, which comprises the precipitated silver particles, and then washing and drying same to recover silver powder; and a silver powder coating step of injecting a pH adjuster into the recovered silver powder to adjust the pH, and then injecting a coating agent to coat after the pH adjustment. The pH adjuster is used in the silver powder coating step to adjust the pH, and thus, when silver power is used in a conductive paste, as the rate of change in viscosity over time is low, a conductive paste having excellent viscosity stability can be provided.

A conductive film that includes particles of a layered material including one or plural layers, wherein the one or plural layers include a layer body represented by: M.sub.mX.sub.n, wherein M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n and 5 or less, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom, and wherein a χ-axis direction rocking curve half-value width for a peak of a (001) plane (1 is a natural number multiple of 2) obtained by X-ray diffraction measurement of the conductive film is 10.3° or less.

A conductive film that includes particles of a layered material including one or plural layers, wherein the one or plural layers include a layer body represented by: M.sub.mX.sub.n, wherein M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n and 5 or less, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom, and wherein a χ-axis direction rocking curve half-value width for a peak of a (001) plane (1 is a natural number multiple of 2) obtained by X-ray diffraction measurement of the conductive film is 10.3° or less.

Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, a compatibilizing agent, and an optional thickening agent.