H01B1/22

Conductive composites

Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, a compatibilizing agent, and an optional thickening agent.

Compressible foam electrode

A foam electrode comprising surface treatment by the steps of: 1) impregnating soft compressible polymeric foams with a conductive coating via sequential infiltration synthesis and 2) functionalizing the chemically altered voids with an ultrathin redox coating to enhance capacitive deionization (CDI). The redox coating will allow treated foam to absorb ions under the application of a bias, and mechanical compression/decompression. The CDI apparatus uses the void volume of the foam in the uncompressed state to flow liquids through it while the compressed state is used to enhance desalination by limiting the diffusion pathways for the ions to find an adsorption surface.

Compressible foam electrode

A foam electrode comprising surface treatment by the steps of: 1) impregnating soft compressible polymeric foams with a conductive coating via sequential infiltration synthesis and 2) functionalizing the chemically altered voids with an ultrathin redox coating to enhance capacitive deionization (CDI). The redox coating will allow treated foam to absorb ions under the application of a bias, and mechanical compression/decompression. The CDI apparatus uses the void volume of the foam in the uncompressed state to flow liquids through it while the compressed state is used to enhance desalination by limiting the diffusion pathways for the ions to find an adsorption surface.

CONDUCTIVE POLYMER ADHESIVE AND METHOD OF PREPARING THE SAME

Disclosed is a conductive polymer composite according to various embodiments of the present invention in order to implement the above-described object. The conductive polymer composite may include a polymer adhesive which includes a curable polymer and a curing agent, a conductive filler made of a metal having electrical properties, and a substituting agent configured to substitute for or remove a lubricant layer applied on the conductive filler.

CONDUCTIVE POLYMER ADHESIVE AND METHOD OF PREPARING THE SAME

Disclosed is a conductive polymer composite according to various embodiments of the present invention in order to implement the above-described object. The conductive polymer composite may include a polymer adhesive which includes a curable polymer and a curing agent, a conductive filler made of a metal having electrical properties, and a substituting agent configured to substitute for or remove a lubricant layer applied on the conductive filler.

Copper powder and method for producing same

While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx.sub.(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

Copper powder and method for producing same

While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx.sub.(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

Base configured as an electronic component or a circuit board

A base includes a main body and a multilayer metal film disposed on the main body. The multilayer metal film includes a first metal film disposed on the main body, the first metal film having conductivity, second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching, and a third metal film on the second metal film, the third metal film having wettability. The third metal film includes an inwardly extended portion extending between the second metal film and the main body.

Three phase immiscible polymer-metal blends for high conductivity composites

Provided is a method of forming a conductive polymer composite. The method includes forming a mixture. The mixture includes a first thermoplastic polymer, a second thermoplastic polymer and a plurality of metal particles. The first thermoplastic polymer and the second thermoplastic polymer are immiscible with each other. The plurality of metal particles include at least one metal that is immiscible with both the first thermoplastic polymer and the second thermoplastic polymer. The method includes heating the mixture to a temperature greater than or equal to a melting point of the metal.

Three phase immiscible polymer-metal blends for high conductivity composites

Provided is a method of forming a conductive polymer composite. The method includes forming a mixture. The mixture includes a first thermoplastic polymer, a second thermoplastic polymer and a plurality of metal particles. The first thermoplastic polymer and the second thermoplastic polymer are immiscible with each other. The plurality of metal particles include at least one metal that is immiscible with both the first thermoplastic polymer and the second thermoplastic polymer. The method includes heating the mixture to a temperature greater than or equal to a melting point of the metal.