A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A method for producing an at least two-part structure, such as a semifinished product for a superconducting wire is provided. A first structure and a second structure are separately produced, and the first structure and the second structure are then inserted into one another. The first structure and the second structure are respectively produced in layers by selective laser melting or selective electron beam melting of a powder. The method produces two-part structures for semifinished products of superconducting wires.

A method for producing an at least two-part structure, such as a semifinished product for a superconducting wire is provided. A first structure and a second structure are separately produced, and the first structure and the second structure are then inserted into one another. The first structure and the second structure are respectively produced in layers by selective laser melting or selective electron beam melting of a powder. The method produces two-part structures for semifinished products of superconducting wires.

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

Provided is a superconductive wire comprising: a superconductive wire core which has a first main surface extending in the longitudinal direction and a second main surface located on the side opposite to the first main surface; a first heat dissipation member disposed on the first main surface; and a second heat dissipation member disposed on the second main surface. The first heat dissipation member is connected to the first main surface at a plurality of first connection locations lined up along the longitudinal direction. The second heat dissipation member is connected to the second main surface at a plurality of second connection locations lined up along the longitudinal direction. In the planar view from the thickness direction of the superconductive wire, each of the plurality of first connection locations and a corresponding one of the plurality of second connection locations are arranged with an offset from each other.

An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

The present invention provides a system and method for producing superconducting joints between superconductive segments of a Bi-2212 high-temperature superconducting (HTS) conductor, thereby eliminating the heat generating resistive joints that are commonly known in the art for connecting two or more smaller Bi-2212 conductive segments to create an Bi-2212 conductor of adequate length.