The present invention provides a system and method for producing superconducting joints between superconductive segments of a Bi-2212 high-temperature superconducting (HTS) conductor, thereby eliminating the heat generating resistive joints that are commonly known in the art for connecting two or more smaller Bi-2212 conductive segments to create an Bi-2212 conductor of adequate length.

Provided is a low-resistance connection body for a high-temperature superconducting wire, in which a high-temperature superconducting bulk body and a high-temperature superconducting wire including a high-temperature superconducting layer are connected to each other, wherein a melting point of the high-temperature superconducting layer is higher than a melting point of the high-temperature superconducting bulk body; the high-temperature superconducting layer and the high-temperature superconducting bulk body are in contact at a connection site of the high-temperature superconducting wire and the high-temperature superconducting bulk body; and a surface of the high-temperature superconducting bulk body that is in contact with the high-temperature superconducting layer is crystallized due to crystal growth. Two high-temperature superconducting wires can be connected, with low resistance, through connection of the two high-temperature superconducting wires to one high-temperature superconducting bulk.

Provided is a low-resistance connection body for a high-temperature superconducting wire, in which a high-temperature superconducting bulk body and a high-temperature superconducting wire including a high-temperature superconducting layer are connected to each other, wherein a melting point of the high-temperature superconducting layer is higher than a melting point of the high-temperature superconducting bulk body; the high-temperature superconducting layer and the high-temperature superconducting bulk body are in contact at a connection site of the high-temperature superconducting wire and the high-temperature superconducting bulk body; and a surface of the high-temperature superconducting bulk body that is in contact with the high-temperature superconducting layer is crystallized due to crystal growth. Two high-temperature superconducting wires can be connected, with low resistance, through connection of the two high-temperature superconducting wires to one high-temperature superconducting bulk.

A method and system for manufacturing a superconducting material is described. In one embodiment, a layer of refractory cushion is placed over a spool. A first layer of superconducting cable is wound over the first layer of refractory cloth. The superconducting cable is reaction heat-treated on the spool. A first layer of refractory fabric can be placed over the layer of refractory cushion. One or more adjustment mechanisms can be disposed between the first layer of the superconducting cable and the spool.

A method and system for manufacturing a superconducting material is described. In one embodiment, a layer of refractory cushion is placed over a spool. A first layer of superconducting cable is wound over the first layer of refractory cloth. The superconducting cable is reaction heat-treated on the spool. A first layer of refractory fabric can be placed over the layer of refractory cushion. One or more adjustment mechanisms can be disposed between the first layer of the superconducting cable and the spool.

A wire connection device includes: a holding base which is provided with a wire accommodation groove having a width, the wire accommodation groove being configured to accommodate a plurality of wires; a pressing plate which is positioned above the holding base; a heating body which is positioned above the pressing plate and includes a heating member; a first driver which drives the holding base and the pressing plate away from or toward one another; and a second driver which drives the holding base and the heating body toward or away from one another, in which the pressing plate which is driven toward the holding base by the first driver presses together the plurality of wires accommodated in the wire accommodation groove with solder interposed therebetween.

A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.