H01C1/014

CHIP RESISTOR AND MOUNTING STRUCTURE THEREOF
20190228886 · 2019-07-25 ·

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

CHIP RESISTOR AND MOUNTING STRUCTURE THEREOF
20190228886 · 2019-07-25 ·

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

Modular overvoltage protection units

A modular overvoltage protection unit for electrically connecting a first power line and/or a second power line to a protected earth (PE) line in the case of an overvoltage event on the first or second power line includes a unit enclosure defining an enclosure cavity, and first and second surge protection devices (SPDs) each disposed in the enclosure cavity. Each of the first and second SPDs includes: a first electrode in the form of a metal housing defining a housing cavity; a second electrode disposed within the housing cavity; and a varistor member captured between and electrically connected with each of the first and second electrodes, wherein the varistor member is formed of a varistor material. The overvoltage protection unit further includes: a first line terminal to connect the first power line to the overvoltage protection unit, wherein the first line terminal is electrically connected to the second electrode of the first SPD; a second line terminal to connect the second power line to the overvoltage protection unit, wherein the second line terminal is electrically connected to the second electrode of the second SPD; and a PE terminal to connect the PE line to the overvoltage protection unit, wherein the PE terminal is electrically connected to the metal housing of the second SPD. The metal housing of the first SPD is electrically connected to the PE terminal through the metal housing of the second SPD.

ELECTRONIC COMPONENT
20190189309 · 2019-06-20 · ·

An insulating sheet and a conductive terminal are provided in an electronic component, where at least one of the conductive terminals has a missing part, and where a remaining part positioned on both ends of the missing part is connected through a resistor element affixed to the insulating sheet.

PTC circuit protection device and method of making the same

A PTC circuit protection device adapted to be mounted on a substrate, includes: a PPTC component; a first electrically conductive unit including a first electrically conductive member and a first conductive pin member that has a first distal end to be in contact with the substrate, a first stand-off height from the first electrically conductive member to the first distal end being not less than 0.1 mm; and a second electrically conductive unit including a second electrically conductive member and a second conductive pin member that has a second distal end to be in contact with the substrate, a second stand-off height from the first electrically conductive member to the second distal end being not less than 0.1 mm.

Chip resistor and mounting structure thereof
10290401 · 2019-05-14 · ·

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

Chip resistor and mounting structure thereof
10290401 · 2019-05-14 · ·

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

PTC CIRCUIT PROTECTION DEVICE AND METHOD OF MAKING THE SAME
20190139684 · 2019-05-09 ·

A PTC circuit protection device adapted to be mounted on a substrate, includes: a PPTC component; a first electrically conductive unit including a first electrically conductive member and a first conductive pin member that has a first distal end to be in contact with the substrate, a first stand-off height from the first electrically conductive member to the first distal end being not less than 0.1 mm; and a second electrically conductive unit including a second electrically conductive member and a second conductive pin member that has a second distal end to be in contact with the substrate, a second stand-off height from the first electrically conductive member to the second distal end being not less than 0.1 mm.

Composite electronic component and resistance element

A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, a protective film and first and second upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction and the resistor is between the first and second upper surface conductors. The protective film covers the resistor. Dimensions in the height direction from the upper surface of the base portion to exposed surfaces of a pair of end portions in the length direction of the protective film are smaller than a dimension in the height direction from the upper surface of the base portion to an exposed surface of the protective film in the center portion.

Composite electronic component and resistance element

A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, a protective film and first and second upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction and the resistor is between the first and second upper surface conductors. The protective film covers the resistor. Dimensions in the height direction from the upper surface of the base portion to exposed surfaces of a pair of end portions in the length direction of the protective film are smaller than a dimension in the height direction from the upper surface of the base portion to an exposed surface of the protective film in the center portion.