A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

A power resistor comprises a tubular housing composed of metal and a resistor element received therein, wherein the housing has four side walls that extend along a longitudinal axis of the housing between two ends and define a rectangular cross-section. The housing comprises four edges of the four side walls at at least one of the two ends. Two of the four side walls have a respective incision at their edges for introducing a fastening element and the two other side walls have a respective clearance in alignment with the oppositely disposed incision to facilitate a placement of a tool at a fastening element introduced into the respective incision.

A resistor assembly is disclosed and comprises a surface mounted layer comprising a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a second layer disposed underneath the surface mounted layer. The second layer comprises an embedded thin film resistor electrically coupled to the surface mounted layer. The plurality of trimming bridges are each removable to increase a resistance of the embedded thin film resistor. The resistor assembly also comprises a plurality of vias that electrically couple the first conductive trace of the surface mounted layer to the embedded thin film resistor.

A sheath heater includes: a housing having an accommodating space formed therein; a plurality of main terminals electrically connected to an outside of the sheath heater through an electric circuit, wherein the accommodating space is filled with magnesia and the plurality of main terminals are disposed in the accommodating space to penetrate through one side and another side of the housing; an overheat preventing means located in the housing, connected in series with the electric circuit, and having a PTC element controlling a flow of current of the electric circuit according to a temperature of the PTC element; and a heating element electrically connected to the electric circuit and generating heat during the flow of current.

A sheath heater includes: a housing having an accommodating space formed therein; a plurality of main terminals electrically connected to an outside of the sheath heater through an electric circuit, wherein the accommodating space is filled with magnesia and the plurality of main terminals are disposed in the accommodating space to penetrate through one side and another side of the housing; an overheat preventing means located in the housing, connected in series with the electric circuit, and having a PTC element controlling a flow of current of the electric circuit according to a temperature of the PTC element; and a heating element electrically connected to the electric circuit and generating heat during the flow of current.

A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580 C. to 760 C. This chip resistor prevents the resistive element from being peeled off.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.