A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

A method of forming a positive temperature coefficient (PTC) device, the method including providing a core formed of a PTC material, the core having an electrode disposed on a first surface thereof and a second electrode disposed on a second surface thereof, connecting a first lead element to the first electrode, applying an oxygen barrier epoxy to at least portions of the core, the first electrode, the second electrode, and the first lead element, and curing the oxygen barrier epoxy to form an oxygen barrier package surrounding at least portions of the core, the first electrode, the second electrode, and the first lead element.

A chip resistor includes a board, first and second electrodes disposed on one surface of the board, and a resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (CuMnSn) alloy. In the CuMnSn alloy, a percentage of Mn ranges from 11% to 20%, a percentage of Sn ranges from 2% to 8%, and a total percentage of Mn and Sn ranges from 13.5% to 22.5%.

A chip resistor includes a board, first and second electrodes disposed on one surface of the board, and a resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (CuMnSn) alloy. In the CuMnSn alloy, a percentage of Mn ranges from 11% to 20%, a percentage of Sn ranges from 2% to 8%, and a total percentage of Mn and Sn ranges from 13.5% to 22.5%.

To provide a wire-wound resistor provided with high reliability and that retains the basic functionality of the wire-wound resistor, and a method for manufacturing the same. A wire-wound resistor in which a resistor wire is wound onto an external periphery of a core (11) obtained by bundling fibrous insulators, and a connection terminal (13) is attached to both ends of the core (11) and connected to the resistor wire (12a), wherein the core (11) is impregnated with a binder in the portion (11a) in the vicinity of the external periphery. The binder (1) is preferably not included in a center portion (11b) of the core (11).

A power resistor has paired harness electric wires that have one end parts connected to a resistor substrate, and other end parts pass through an exterior material made of insulating resin and extend outward. Crimp terminals, which are means for reinforcing affinity between the coating material of the harness electric wires and the insulating resin, i.e., the exterior material and for maintaining adhesion, are formed on predetermined portions of the harness electric wires. As a result, a short and small power resistor suitable for an in-vehicle environment is provided.

A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.

The present disclosure provides a surge protector device comprising an electrical connector for connecting said surge protector device to a current network, at least one metal oxide varistor (MOV) connected to said electrical connector; and a first containment unit at least partially filled with a medium having dielectric, heat resistance and elastic properties embedding said at least one MOV unit within said first containment unit, said containment unit having at least one opening; wherein upon failure of said at least one MOV unit due to a surge in said current network said opening allows expansion gases created by said at least one MOV unit to be discharged from said first containment unit. In another embodiment, the surge protector connects directing to an electrical board and discharges expansion gases therein.

A sheath heater includes: a housing having an accommodating space formed therein; a plurality of main terminals electrically connected to an outside of the sheath heater through an electric circuit, wherein the accommodating space is filled with magnesia and the plurality of main terminals are disposed in the accommodating space to penetrate through one side and another side of the housing; an overheat preventing means located in the housing, connected in series with the electric circuit, and having a PTC element controlling a flow of current of the electric circuit according to a temperature of the PTC element; and a heating element electrically connected to the electric circuit and generating heat during the flow of current.