A sheath heater includes: a housing having an accommodating space formed therein; a plurality of main terminals electrically connected to an outside of the sheath heater through an electric circuit, wherein the accommodating space is filled with magnesia and the plurality of main terminals are disposed in the accommodating space to penetrate through one side and another side of the housing; an overheat preventing means located in the housing, connected in series with the electric circuit, and having a PTC element controlling a flow of current of the electric circuit according to a temperature of the PTC element; and a heating element electrically connected to the electric circuit and generating heat during the flow of current.

A resistor has a structure including a resistor substrate that has paired electrodes and a resistive element formed on an insulating substrate, an insulating exterior material that covers at least the upper and the side surface of the resistor substrate, and harness electric wires that have one end parts connected to the respective electrodes, pass through the exterior material, and extend outside. The paired electrodes are formed on areas other than the end parts of the insulating substrate, and junctions of the end parts of the harness electric wires and the paired electrodes are at positions where creepage distance of insulation from the junctions to the bottom ends of the insulating substrate is a predetermined distance or longer. Such structure provides the resistor having a secured creepage distance of insulation between the conductor parts of the resistor and the metal case in which the resistor is installed.

A resistor has a structure including a resistor substrate that has paired electrodes and a resistive element formed on an insulating substrate, an insulating exterior material that covers at least the upper and the side surface of the resistor substrate, and harness electric wires that have one end parts connected to the respective electrodes, pass through the exterior material, and extend outside. The paired electrodes are formed on areas other than the end parts of the insulating substrate, and junctions of the end parts of the harness electric wires and the paired electrodes are at positions where creepage distance of insulation from the junctions to the bottom ends of the insulating substrate is a predetermined distance or longer. Such structure provides the resistor having a secured creepage distance of insulation between the conductor parts of the resistor and the metal case in which the resistor is installed.

Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the pair of electrodes, in which the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film.

Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the pair of electrodes, in which the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film.

Provided is a chip resistor in which cracks, fracture, etc. can be surely prevented from occurring due to thermal stress in solder bonding portions. The chip resistor 1 includes: a ceramic substrate 2 that is shaped like a cuboid; a pair of front electrodes 3 that are provided on lengthwise opposite end portions of a front surface of the ceramic substrate 2; a resistor body 4 that is provided between and connected to the two front electrodes 3; a protective layer 5 that covers the resistor body 4; a pair of back electrodes 6 that are provided on lengthwise opposite end portions of a back surface of the ceramic substrate 2; end-surface electrodes 7 through which the front electrodes 3 and the back electrodes 6 are electrically conductively connected to each other respectively; external electrodes 8 that cover the end-surface electrodes 7; and a pair of insulating resin layers 9 that are provided to cover edge portions of the back electrodes 6; wherein: the pair of insulating resin layers 9 are opposed to each other with interposition of a predetermined interval therebetween on the back surface of the ceramic substrate 2; and at least opposed side end portions of the insulating resin layers 9 are exposed from the external electrodes 8.

A ceramic electronic component includes an electronic component body and portions of first and second metal terminals defined by lead wires covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protruding bending portions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.

Provided is a charging connector (11) including a terminal (15), a housing (13) which is formed with a lance (33) which prevents the terminal (15) in a terminal receiving chamber 29 from slipping, a front holder (21) which abuts on the lance (33) which prevents slipping of the terminal (15) so as to regulate an engagement release of the lance (33), and a thermistor element (17) which is pressed and biased by the front holder (21) to be brought into close contact with the terminal (15) directly or through a molding resin material.

To provide a sealing glass composition capable of forming a sealing material, which has properties suitable for sealing electronic components and which is able to withstand higher temperature ranges. Provided is a glass composition for producing a glass ceramic sealant containing at least CaOZnOSiO.sub.2-based crystals, this sealing glass composition containing at least following components: 1) 35 to 55 mol. % of SiO.sub.2, 2) 15 to 45 mol. % of CaO, 3) 1 to 25 mol. % of ZnO, 4) 0 to 25 mol. % of Al.sub.2O.sub.3, and 5) a total of 0 to 20 mol. % of RO where R represents at least one of Mg, Sr and Ba.

A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.