An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

Disclosed are a resistor, a heat dissipater and a combinatory device of the resistor and the heat dissipater, and relates to the field of power electronics. The resistor is cylindrical, and comprises a metal end, an insulating part, a casing, metal bars, a resistor wire, thermally conductive insulating fillers and a metal connection mechanism. The metal connection mechanism of the resistor and the heat dissipater are connected by means of direct contact. The structure and the connection method can shorten the length of the resistor, completely insulate the electrical circuits of the resistor from the possible leakage of the water inlet- and outlet-pipe of the heat dissipater, and enable the combinatory device of the resistor and the heat dissipater to be structurally more compact and the connections thereof cleaner.

Disclosed are a resistor, a heat dissipater and a combinatory device of the resistor and the heat dissipater, and relates to the field of power electronics. The resistor is cylindrical, and comprises a metal end, an insulating part, a casing, metal bars, a resistor wire, thermally conductive insulating fillers and a metal connection mechanism. The metal connection mechanism of the resistor and the heat dissipater are connected by means of direct contact. The structure and the connection method can shorten the length of the resistor, completely insulate the electrical circuits of the resistor from the possible leakage of the water inlet- and outlet-pipe of the heat dissipater, and enable the combinatory device of the resistor and the heat dissipater to be structurally more compact and the connections thereof cleaner.

A resistor includes: a first resin protruding part formed in the bottom surface of an exterior material (mold resin body), on an end opposite to a leading side of harness wires along the length of the exterior material near a through-hole piercing an upper surface and a lower surface of the exterior material, and a second resin protruding part, surrounding the circumference of a metal bush embedded in the through-hole and the entire circumference of the resistor substrate. Moreover, a concave part is formed in a region sandwiched between the first resin protruding part and the second resin protruding part.

A temperature sensor includes: a thermistor; a pair of lead-out wires each having a front end connected to the thermistor; a glass body for sealing the thermistor and the front ends of the lead-out wires; a pair of leadwires each having a front end connected to the rear end of each of the pair of lead-out wires; and a synthetic resin covering layer for covering the glass body, the pair of lead-out wires excepting the front end portions, and the front end portions of the pair of lead wires. The covering layer shaped as a tube is arranged by: elastically expanding a laminate of a tubular inner layer and a tubular outer layer so as to be fitted forcibly onto the glass body, the pair of lead-out wires excepting the front end portions, and the front end portions of the pair of lead wires; and applying heat to melt the inner layer and to shrink the outer layer. The peripheral surface of the glass body is brought into a direct contact with the outer layer without the inner layer interposed.

[Problem] To provide a load resistor: which has arranged therein a plurality of resistant rods that generate heat only to about 100° C. or less due to power supply from an emergency power generator, for example, and that rapidly lose the heat by mere exposure to the air; and which, therefore, does not need a cooling device to be installed for forcibly cooling the resistant rods, or a cooling fan that would be extremely heavy, have a large capacity, and end up accounting for about half of the ;eight and about the lower half of the volume constituting the load resistor. [Solution] The present invention is a load resistor that receives power transmitted from an apparatus and performs an energization test on the apparatus. The load resistor is characterized by comprising a rod-shaped resistive base body that is energized with the power and generates heat, a pipe-shaped protective member through which the rod-shaped resistive base body penetrates, and rod-shaped resistors having an insulation member that are packed in between the rod-shaped resistive base body and the protective member, the rod-shaped resistive base body having used therein a stretched nichrome wire that is wound in the shape of a coil.

[Problem] To provide a load resistor: which has arranged therein a plurality of resistant rods that generate heat only to about 100° C. or less due to power supply from an emergency power generator, for example, and that rapidly lose the heat by mere exposure to the air; and which, therefore, does not need a cooling device to be installed for forcibly cooling the resistant rods, or a cooling fan that would be extremely heavy, have a large capacity, and end up accounting for about half of the ;eight and about the lower half of the volume constituting the load resistor. [Solution] The present invention is a load resistor that receives power transmitted from an apparatus and performs an energization test on the apparatus. The load resistor is characterized by comprising a rod-shaped resistive base body that is energized with the power and generates heat, a pipe-shaped protective member through which the rod-shaped resistive base body penetrates, and rod-shaped resistors having an insulation member that are packed in between the rod-shaped resistive base body and the protective member, the rod-shaped resistive base body having used therein a stretched nichrome wire that is wound in the shape of a coil.

A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.

A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.

A connector for providing electronic communication with an electronic device is disclosed. The connector can comprise a substrate comprising layers of non-conductive material and conductive material. The connector can include an interface member mounted to the substrate and electrically connected with the conductor. A positive temperature coefficient (PTC) fuse can be embedded in the substrate and electrically connected with the conductor and the interface member. At least a portion of the PTC fuse can be disposed directly below the interface member.