Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the pair of electrodes, in which the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element.

A braking resistance device for a vehicle has a plurality of braking resistance elements each having a tubular heat-conducting casing. A heat-conducting and electrically insulating material is disposed in the casing. An electrical conductor is embedded in the insulating material over a majority of the longitudinal extent of the casing. Furthermore, the braking resistance device has a stacking arrangement which is designed to be passively cooled. The stacking arrangement has a plurality of layers which are arranged one above the other in a stacking direction and each including the braking resistance elements of the plurality of braking resistance elements which are arranged substantially parallel to one another.

A chip component 10 comprises: an insulating substrate 1 on which a resistor 3 serving as a functional element is formed; a pair of internal electrodes (front electrodes 2, end surface electrodes 6, and back electrodes 5) that is formed to cover both end portions of the insulating substrate 1 and connected to the resistor 3; a barrier layer 8 that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer 9 that is formed on a surface of the barrier layer 8 and mainly composed of tin, and the barrier layer 8 is composed of alloy plating (NiP) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layer 8 has magnetic properties.

A chip component 10 comprises: an insulating substrate 1 on which a resistor 3 serving as a functional element is formed; a pair of internal electrodes (front electrodes 2, end surface electrodes 6, and back electrodes 5) that is formed to cover both end portions of the insulating substrate 1 and connected to the resistor 3; a barrier layer 8 that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer 9 that is formed on a surface of the barrier layer 8 and mainly composed of tin, and the barrier layer 8 is composed of alloy plating (NiP) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layer 8 has magnetic properties.

Provided is a resistor provided with a resistance body and electrodes provided on the resistance body, and the resistance body has an oxide film on a surface.

Provided is a resistor provided with a resistance body and electrodes provided on the resistance body, and the resistance body has an oxide film on a surface.

A chip resistor includes: an insulating substrate having a first main surface, a first side surface, and a second side surface, the first main surface being an end surface in a thickness direction of the chip resistor, and the first side surface and the second side surface each being an end surface in a longitudinal direction of the chip resistor; a first front surface electrode disposed on an end portion of the first main surface on a side close to the first side surface; a second front surface electrode disposed on an end portion of the first main surface on a side close to the second side surface; a resistor body disposed on the first main surface and electrically connected to the first front surface electrode and the second front surface electrode.

A chip resistor includes: an insulating substrate having a first main surface, a first side surface, and a second side surface, the first main surface being an end surface in a thickness direction of the chip resistor, and the first side surface and the second side surface each being an end surface in a longitudinal direction of the chip resistor; a first front surface electrode disposed on an end portion of the first main surface on a side close to the first side surface; a second front surface electrode disposed on an end portion of the first main surface on a side close to the second side surface; a resistor body disposed on the first main surface and electrically connected to the first front surface electrode and the second front surface electrode.