Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the pair of electrodes, in which the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element.

An epoxy-based resin system composition includes a latent functionality for polymer adhesion improvement. The composition may be used to produce an overcoat layer and/or protection layer in an anti-sulfur resistor (ASR). In some embodiments, the composition include epoxy-based resin(s), hardener(s) and, optionally, blowing agent(s) and/or filler(s). An epoxide functionality of one or more of the epoxy-based resin(s) and a reactive functionality of one or more of the hardener(s) react with each other at a first temperature. The latent functionality, which does not react at the first temperature, is contained in at least one of the epoxy-based resin(s), hardener(s) and filler(s) and reacts in response to another stimulus (e.g., UV light/initiator and/or a second temperature greater than the first temperature) to enhance chemical bonding. Optionally, voids created via etching and/or the blowing agent(s) may be used to enhance mechanical bonding, alone, or in combination with filler(s) exposed in the voids.

An epoxy-based resin system composition includes a latent functionality for polymer adhesion improvement. The composition may be used to produce an overcoat layer and/or protection layer in an anti-sulfur resistor (ASR). In some embodiments, the composition include epoxy-based resin(s), hardener(s) and, optionally, blowing agent(s) and/or filler(s). An epoxide functionality of one or more of the epoxy-based resin(s) and a reactive functionality of one or more of the hardener(s) react with each other at a first temperature. The latent functionality, which does not react at the first temperature, is contained in at least one of the epoxy-based resin(s), hardener(s) and filler(s) and reacts in response to another stimulus (e.g., UV light/initiator and/or a second temperature greater than the first temperature) to enhance chemical bonding. Optionally, voids created via etching and/or the blowing agent(s) may be used to enhance mechanical bonding, alone, or in combination with filler(s) exposed in the voids.

A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

An epoxy-based resin system composition includes a latent functionality for polymer adhesion improvement. The composition may be used to produce an overcoat layer and/or protection layer in an anti-sulfur resistor (ASR). In some embodiments, the composition include epoxy-based resin(s), hardener(s) and, optionally, blowing agent(s) and/or filler(s). An epoxide functionality of one or more of the epoxy-based resin(s) and a reactive functionality of one or more of the hardener(s) react with each other at a first temperature. The latent functionality, which does not react at the first temperature, is contained in at least one of the epoxy-based resin(s), hardener(s) and filler(s) and reacts in response to another stimulus (e.g., UV light/initiator and/or a second temperature greater than the first temperature) to enhance chemical bonding. Optionally, voids created via etching and/or the blowing agent(s) may be used to enhance mechanical bonding, alone, or in combination with filler(s) exposed in the voids.