An electronic component includes a temperature sensor including a pair of electrodes, at least one metal block electrically connected to an electrode of the temperature sensor, an insulation portion in which the temperature sensor and the at least one metal block are embedded, and an external terminal electrically connected to the electrode of the temperature sensor. The at least one metal block includes a flat surface exposed from the insulation portion. The flat surface defines the external terminal.

An electronic component includes a temperature sensor including a pair of electrodes, at least one metal block electrically connected to an electrode of the temperature sensor, an insulation portion in which the temperature sensor and the at least one metal block are embedded, and an external terminal electrically connected to the electrode of the temperature sensor. The at least one metal block includes a flat surface exposed from the insulation portion. The flat surface defines the external terminal.

Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

A valve-type arrester includes a heat sink for dissipating heat from the interior of the valve-type arrester into the surroundings of the valve-type arrester. The heat sink has a circular-cylindrical main body with a base surface, a top surface parallel to the base surface and a casing surface connecting the base surface and the top surface. The heat sink additionally has a plurality of fins disposed on the main body, in which each fin is formed in the shape of a sheet or a leaf and disposed on the casing surface of the main body.

A valve-type arrester includes a heat sink for dissipating heat from the interior of the valve-type arrester into the surroundings of the valve-type arrester. The heat sink has a circular-cylindrical main body with a base surface, a top surface parallel to the base surface and a casing surface connecting the base surface and the top surface. The heat sink additionally has a plurality of fins disposed on the main body, in which each fin is formed in the shape of a sheet or a leaf and disposed on the casing surface of the main body.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element via conductive layers and solderable layers.

The present disclosure relates to semiconductor structures and, more particularly, to heat dissipating structures and methods of manufacture. The structure includes: a thin film resistor within a back end of the line structure; and a heat dissipating structure below the thin film resistor, the heat dissipating structure includes a top plate with a slotted configuration and being within the back end of the line structure.

The present disclosure relates to semiconductor structures and, more particularly, to heat dissipating structures and methods of manufacture. The structure includes: a thin film resistor within a back end of the line structure; and a heat dissipating structure below the thin film resistor, the heat dissipating structure includes a top plate with a slotted configuration and being within the back end of the line structure.

A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.