An object is to provide a chip resistor in which hot spots can be dispersed and the adverse effects on performance caused by microcracks can also be reduced. A chip resistor includes an insulating substrate, a resistive element, and electrodes. In the resistive element, a first trimming groove and a second trimming groove are formed. A first vertical groove of the first trimming groove and a second vertical groove of the second trimming groove are formed with a spacing in between in an X1-X2 direction. A first horizontal groove of the first trimming groove and a second horizontal groove of the second trimming groove extend in directions approaching each other, and terminal ends of the first horizontal groove and the second horizontal groove are formed to be separated in the X1-X2 direction such that the first horizontal groove and the second horizontal groove do not overlap in a Y1-Y2 direction.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

The present invention is a load resistor that receives power transmitted from an apparatus and performs an energization test on the apparatus. The load resistor is characterized by comprising a rod-shaped resistive base body that is energized with the power and generates heat, a pipe-shaped protective member through which the rod-shaped resistive base body penetrates, and rod-shaped resistors having an insulation member that are packed in between the rod-shaped resistive base body and the protective member, the rod-shaped resistive base body having used therein a stretched nichrome wire that is wound in the shape of a coil.

A high-power resistor includes a substrate, a resistor layer, two edge electrodes, and a seed layer. The substrate has a first surface. The resistor layer is mounted on the first surface of the substrate. The two edge electrodes are mounted on the resistor layer. The seed layer is mounted between the resistor layer and the two edge electrodes. A contacting surface between one of the two edge electrodes and the resistor layer is bigger than contacting side surfaces of a printed resistor layer and printed conduction layers from a conventional chip resistor, creating less electrical resistance. When high-power electricity passes through the resistor layer, heat generated by a large passing current can be equally dissipated in all directions on the contact surface. With less electrical resistance and better heat dissipation, the contacting surface enables the high-power resistor to tolerate greater electric power.

A high-power resistor includes a substrate, a resistor layer, two edge electrodes, and a seed layer. The substrate has a first surface. The resistor layer is mounted on the first surface of the substrate. The two edge electrodes are mounted on the resistor layer. The seed layer is mounted between the resistor layer and the two edge electrodes. A contacting surface between one of the two edge electrodes and the resistor layer is bigger than contacting side surfaces of a printed resistor layer and printed conduction layers from a conventional chip resistor, creating less electrical resistance. When high-power electricity passes through the resistor layer, heat generated by a large passing current can be equally dissipated in all directions on the contact surface. With less electrical resistance and better heat dissipation, the contacting surface enables the high-power resistor to tolerate greater electric power.

A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

The invention relates to a production method for an electrical resistance element (for example a shunt) with the following steps: -providing a resistance alloy in powder form, and -forming the resistance element from the powdered resistance material. The invention also relates to a correspondingly produced resistance element.

A resistor includes: a first resin protruding part formed in the bottom surface of an exterior material (mold resin body), on an end opposite to a leading side of harness wires along the length of the exterior material near a through-hole piercing an upper surface and a lower surface of the exterior material, and a second resin protruding part, surrounding the circumference of a metal bush embedded in the through-hole and the entire circumference of the resistor substrate. Moreover, a concave part is formed in a region sandwiched between the first resin protruding part and the second resin protruding part.

A resistor includes: a first resin protruding part formed in the bottom surface of an exterior material (mold resin body), on an end opposite to a leading side of harness wires along the length of the exterior material near a through-hole piercing an upper surface and a lower surface of the exterior material, and a second resin protruding part, surrounding the circumference of a metal bush embedded in the through-hole and the entire circumference of the resistor substrate. Moreover, a concave part is formed in a region sandwiched between the first resin protruding part and the second resin protruding part.