Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element.

A wireless communications device may include an RF transmitter having an operating frequency range, an RF antenna having an electrical length less than or equal to one-tenth of a wavelength of a lowest operating frequency of the operating frequency range, and an RF matching network coupled between the RF transmitter and the RF antenna. The RF matching network may include a first RF matching transformer, a first inductor coupled between a first reference terminal and a reference voltage, a first resistor coupled across a first output terminal and the first reference terminal and configured to dissipate heat that would otherwise be dissipated by the first RF matching transformer to reduce an operating temperature of the first RF matching transformer, and a heat sink coupled to the first resistor.

A wireless communications device may include an RF transmitter having an operating frequency range, an RF antenna having an electrical length less than or equal to one-tenth of a wavelength of a lowest operating frequency of the operating frequency range, and an RF matching network coupled between the RF transmitter and the RF antenna. The RF matching network may include a first RF matching transformer, a first inductor coupled between a first reference terminal and a reference voltage, a first resistor coupled across a first output terminal and the first reference terminal and configured to dissipate heat that would otherwise be dissipated by the first RF matching transformer to reduce an operating temperature of the first RF matching transformer, and a heat sink coupled to the first resistor.

An electrical resistor has a resistance conductor, which is applied to a carrier layer, and two connection elements, which are electrically conductively connected to the resistance conductor. The two connection elements are configured to each be welded or soldered to an electrical contact in order to electrically contact the resistor. The resistance conductor for each connection element has a region that overlaps the corresponding connection element. The overlap region is in electrical contact with the corresponding connection element.

An electrical resistor has a resistance conductor, which is applied to a carrier layer, and two connection elements, which are electrically conductively connected to the resistance conductor. The two connection elements are configured to each be welded or soldered to an electrical contact in order to electrically contact the resistor. The resistance conductor for each connection element has a region that overlaps the corresponding connection element. The overlap region is in electrical contact with the corresponding connection element.

A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.

A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.

A PTC circuit protection device adapted to be mounted on a substrate, includes: a PPTC component; a first electrically conductive unit including a first electrically conductive member and a first conductive pin member that has a first distal end to be in contact with the substrate, a first stand-off height from the first electrically conductive member to the first distal end being not less than 0.1 mm; and a second electrically conductive unit including a second electrically conductive member and a second conductive pin member that has a second distal end to be in contact with the substrate, a second stand-off height from the first electrically conductive member to the second distal end being not less than 0.1 mm.

A PTC circuit protection device adapted to be mounted on a substrate, includes: a PPTC component; a first electrically conductive unit including a first electrically conductive member and a first conductive pin member that has a first distal end to be in contact with the substrate, a first stand-off height from the first electrically conductive member to the first distal end being not less than 0.1 mm; and a second electrically conductive unit including a second electrically conductive member and a second conductive pin member that has a second distal end to be in contact with the substrate, a second stand-off height from the first electrically conductive member to the second distal end being not less than 0.1 mm.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.