A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an AlSi-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of 30 m/50 mm to 700 m/50 mm.

The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an AlSi-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of 30 m/50 mm to 700 m/50 mm.

The present disclosure provides embodiments of power distribution system components, such as arresters, isolators, bushings, and fuses that include one or more end caps that have predefined heat resistant characteristics that can withstand high temperatures without melting, flowing or generating sparks when subject to such high temperatures.

The present disclosure provides embodiments of power distribution system components, such as arresters, isolators, bushings, and fuses that include one or more end caps that have predefined heat resistant characteristics that can withstand high temperatures without melting, flowing or generating sparks when subject to such high temperatures.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element via conductive layers and solderable layers.

The invention relates to a separating device for an overvoltage protection element, wherein the separating device is to be arranged between the overvoltage protection element and a thermal disconnector, wherein the separating device has a first insulating layer and a second insulating layer, wherein a conductive layer is arranged between the first insulating layer and the second insulating layer, wherein the first insulating layer has a first cutout for a contact with the disconnector, and wherein the second insulating layer has a second cutout for a contact with the overvoltage protection element, wherein the cutouts provide a possibility for contacting the conductive layer and the conductive layer provides a thermal bridge between the overvoltage protection element and the thermal disconnector, with the insulating layers making both a thermal and an electrical insulation available, so that heat of the overvoltage protection element can be conducted in a focused manner to the thermal disconnector.

In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an AlSi-based brazing filler material. The AlSi-based brazing filler material has a melting point in a range of approximately 600 C. to 700 C. When the heat sink (23) and the ceramic substrate (11) are joined together using the AlSi-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.

In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an AlSi-based brazing filler material. The AlSi-based brazing filler material has a melting point in a range of approximately 600 C. to 700 C. When the heat sink (23) and the ceramic substrate (11) are joined together using the AlSi-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.