An integrated over-current protection device includes a positive temperature coefficient (PTC) component, a first conductive unit, a second conductive unit, a first conductive via, and a second conductive via. The PTC component includes a first PTC body, and has opposing first and second surfaces. The first conductive unit is disposed on the first surface, and includes a first electrode and a first conductive pad electrically insulated from the first electrode. The second conductive unit is disposed on the second surface, and includes a second electrode and a second conductive pad electrically insulated from the second electrode. The first conductive via extends through the first conductive unit and the PTC component to electrically connect the first electrode to the second conductive pad. The second conductive via extends through the second conductive unit and the PTC component to electrically connect the second electrode to the first conductive pad.

A PTC device comprises a current and temperature sensing element, a first insulating layer, a second insulating layer, a first electrode layer and a second electrode layer. The current and temperature sensing element is a laminated structure comprising a first electrically conductive layer, a second electrically conductive layer and a PTC material layer. The first and second electrically conductive layers are disposed on first and second surfaces of the PTC material layer. The first and second insulating layers are disposed on the first and second electrically conductive layers. The first electrode layer is disposed on the first insulating layer and electrically connects to the first electrically conductive layer. The second electrode layer is disposed on the second insulating layer and electrically connects to the second electrically conductive layer. The first and second electrode layers serve as solder attach surfaces for soldering the PTC device onto a circuit board.

A device may include a lead frame, where the lead frame includes a central portion, and a side pad, the side pad being laterally disposed with respect to the central portion. The device may further include a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion. The device may also include a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.

A PTC thermistor module for a temperature control device may include at least one PTC thermistor element. The PTC thermistor element may include an upper side and an underside facing away from the upper side. The upper side and on the underside may be respectively applied in a heat-exchanging manner with a heat-conducting plate. An edge side, connecting the upper side and the underside with one another in an edge-side manner, of at least one of the PTC thermistor elements, may be applied to a heat-conducting element, which has a thermal conductivity of at least 5 W/mK. A temperature control device may include at least one such PTC thermistor module.

A PTC thermistor module may include at least two PTC thermistor elements. The at least two PTC thermistor elements may be spaced apart from one another by separation sections. The at least two PTC thermistor elements may include two electric lines, spaced apart from one another, for the electrical supply of the PTC thermistor elements. An increased efficiency and operational reliability of the PTC thermistor module are achieved with an electrically insulating receiving body, in which the PTC thermistor elements are received, and which encompasses the PTC thermistor elements in a circumferential direction. A method for producing such a PTC thermistor module and a temperature control device may utilize at least one such PTC thermistor module.

A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part.

A composite circuit protection device includes a polymer positive temperature coefficient (PPTC) component, a voltage-dependent resistor, a first conductive lead and a second conductive lead. The PPTC component is formed with a hole and includes a positive temperature coefficient (PTC) polymeric layer, and first and second electrode layers respectively disposed on two opposite surfaces of the PTC polymeric layer. The hole is formed in the PTC polymeric layer. The voltage-dependent resistor is connected to the second electrode layer of the PPTC component. The first and second conductive leads are respectively bonded to the first electrode layer of the PPTC component and the voltage-dependent resistor.

An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO.sub.3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.

In an electronic component including a ceramic body and an external electrode, the external electrode includes a resin layer including a conductive powder and a plating film in direct contact with the resin layer. The plating film includes a metal with a face-centered cubic structure, and a value of F is about 0.20 or more and about 0.50 or less, where F=(P?P.sub.0)/(1?P.sub.0), P.sub.0=I.sub.0(111)/{I.sub.0(111)+I.sub.0(200)+I.sub.0(220)} and P=I(111)/{I(111)+I(200)+I(220)}, and I.sub.0 (111), I.sub.0 (200), and I.sub.0 (220) are diffraction intensities of a (111) plane, a (200) plane, and a (220) plane obtained from known powder X-ray diffraction data for a metal in the plating film, and I (111), I (200), and I (220) are diffraction intensities of a (111) plane, a (200) plane, and a (220) plane obtained from an X-ray diffraction pattern of the plating film.

A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.