An over-current protection device includes a heat-sensitive layer and an electrode layer. The electrode layer includes a top metal layer and a bottom metal layer, and the heat-sensitive layer attached therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based homopolymer and a polyolefin-based copolymer. The polyolefin-based homopolymer has a first coefficient of thermal expansion (CTE), and the polyolefin-based copolymer has a second CTE lower than the first CTE. The polyolefin-based homopolymer and the polyolefin-based copolymer together form an interpenetrating polymer network (IPN).

An integrated over-current protection device includes a positive temperature coefficient (PTC) component, a first conductive unit, a second conductive unit, a first conductive via, and a second conductive via. The PTC component includes a first PTC body, and has opposing first and second surfaces. The first conductive unit is disposed on the first surface, and includes a first electrode and a first conductive pad electrically insulated from the first electrode. The second conductive unit is disposed on the second surface, and includes a second electrode and a second conductive pad electrically insulated from the second electrode. The first conductive via extends through the first conductive unit and the PTC component to electrically connect the first electrode to the second conductive pad. The second conductive via extends through the second conductive unit and the PTC component to electrically connect the second electrode to the first conductive pad.

A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes that are provided on the surface of the ceramic element. The coating film is selectively formed on the surface of the ceramic element by applying, to the ceramic electronic component, a resin-containing solution containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid.

A PTC circuit protection device adapted to be mounted on a substrate, includes: a PPTC component; a first electrically conductive unit including a first electrically conductive member and a first conductive pin member that has a first distal end to be in contact with the substrate, a first stand-off height from the first electrically conductive member to the first distal end being not less than 0.1 mm; and a second electrically conductive unit including a second electrically conductive member and a second conductive pin member that has a second distal end to be in contact with the substrate, a second stand-off height from the first electrically conductive member to the second distal end being not less than 0.1 mm.

A jelly roll-type PTC device including a PTC material layer, a first electrode layer disposed on a first surface of the PTC material layer, a second electrode layer disposed on a second surface of the PTC material layer opposite the first surface between overlapping portions of the first electrode layer and the second electrode layer, and an insulation layer disposed on a surface of the second electrode layer opposite the PTC material layer and covering a region where the first electrode layer overlaps the second electrode layer, wherein the first electrode layer, the PTC material layer, the second electrode layer, and the insulation layer are rolled together to define a jelly roll structure with the PTC material layer providing an electrically conductive pathway between the overlapping first and second electrode layers, and with the insulation layer providing an electrically insulating barrier between the first and second electrode layers.

A PTC circuit protection device adapted to be mounted on a substrate, includes: a PPTC component; a first electrically conductive unit including a first electrically conductive member and a first conductive pin member that has a first distal end to be in contact with the substrate, a first stand-off height from the first electrically conductive member to the first distal end being not less than 0.1 mm; and a second electrically conductive unit including a second electrically conductive member and a second conductive pin member that has a second distal end to be in contact with the substrate, a second stand-off height from the first electrically conductive member to the second distal end being not less than 0.1 mm.

A method of forming a positive temperature coefficient (PTC) device, the method including providing a core formed of a PTC material, the core having an electrode disposed on a first surface thereof and a second electrode disposed on a second surface thereof, connecting a first lead element to the first electrode, applying an oxygen barrier epoxy to at least portions of the core, the first electrode, the second electrode, and the first lead element, and curing the oxygen barrier epoxy to form an oxygen barrier package surrounding at least portions of the core, the first electrode, the second electrode, and the first lead element.

A device may include a lead frame, where the lead frame includes a central portion, and a side pad, the side pad being laterally disposed with respect to the central portion. The device may further include a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion. The device may also include a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.

A circuit protection device including a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a quantity of solder disposed on a dielectric chip and having a melting temperature that is higher than a trip temperature of the PTC device, wherein the a surface of the dielectric chip exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the surface to create a galvanic opening in the backup fuse.

A polymeric positive temperature coefficient (PPTC) device including a PPTC body, a first electrode disposed on a first side of the PPTC body, and a second electrode disposed on a second side of the PPTC body, wherein the PPTC body is formed of a PPTC material that includes a polymer matrix and a conductive filler, wherein the conductive filler defines 20%-39% by volume of the PPTC material.