An electronic component is disclosed. In an embodiment, the electronic component includes a plurality of functional layers arranged one on top of the other forming a stack, first inner electrodes, and second inner electrodes, each of the first and second inner electrodes arranged between two adjacent functional layers. The electronic component further includes a first outer contact electrically connected to the first inner electrodes and a second outer contact electrically connected to the second inner electrodes, wherein the functional layers are selected such that the first and second outer contacts are electrically conductively connected to one another via the functional layers both in a basic state and in a hot state of the electronic component, wherein a temperature of the hot state is higher than a temperature of the basic state, and wherein the electronic component is an NTC component.

An NTC thermistor to be embedded in a substrate includes a thermistor body that is a ceramic sintered body and includes two opposed main surfaces, two opposed side surfaces, and two opposed end surfaces, a plurality of internal electrodes provided inside the thermistor body, and two external electrodes provided on outer surfaces of the thermistor body, and electrically connected to the plurality of internal electrodes. Each of the external electrodes includes a first electrode layer covering one of the end surfaces of the thermistor body, a second electrode layer provided on each of the main surfaces of the thermistor body, the second electrode layer including at least one layer, one end of the second electrode layer being in contact with the first electrode layer, and another end thereof extending in a direction of another end surface, and a third electrode layer including at least one layer and covering the first electrode and the second electrode layers.

An electronic component includes a temperature sensor including a pair of electrodes, at least one metal block electrically connected to an electrode of the temperature sensor, an insulation portion in which the temperature sensor and the at least one metal block are embedded, and an external terminal electrically connected to the electrode of the temperature sensor. The at least one metal block includes a flat surface exposed from the insulation portion. The flat surface defines the external terminal.

In an embodiment a method for assembling NTC sensor includes providing an NTC thermistor element and connection wires having terminals for contacting the NTC thermistor element; and self-heating the NTC thermistor element while applying an electrical current during the following steps: dispensing solder paste to the terminals of the connection wires, applying the connection wires to the NTC thermistor element and melting the solder paste by a generated heat of the NTC thermistor element thereby forming solder bonds between the NTC thermistor element and the connection wires.

An electronic component is disclosed. In an embodiment, the electronic component includes a plurality of functional layers arranged one on top of the other forming a stack, first inner electrodes, and second inner electrodes, each of the first and second inner electrodes arranged between two adjacent functional layers. The electronic component further includes a first outer contact electrically connected to the first inner electrodes and a second outer contact electrically connected to the second inner electrodes, wherein the functional layers are selected such that the first and second outer contacts are electrically conductively connected to one another via the functional layers both in a basic state and in a hot state of the electronic component, wherein a temperature of the hot state is higher than a temperature of the basic state, and wherein the electronic component is an NTC component.

A circuit board for an electronic device includes pattern areas on both sides of the circuit board. Each end of a thermistor is electrically connected to electrically conductive pads on pattern areas on the top and bottom sides of the circuit board. An input plug is electrically connected to an end of the thermistor. The input plug is electrically connected to the thermistor by way of an input connector to which the circuit board is inserted.

Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer.

A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.

Provided are wireless temperature sensors. A temperature sensor with a flexible, large-area printed thermistor can include an negative temperature coefficient (NTC) thermistor for temperature sensing, a control circuitry for electrically connecting with the NTC thermistor and obtaining the temperature sensed by the NTC thermistor, a power source for providing power supply to the NTC thermistor and the control circuitry, and a frame element for supporting the NTC thermistor, the control circuitry and the power source, where the frame element is at least partially thermally insulated to establish thermal equilibrium within the temperature sensor. The temperature sensor can sense the temperature in a fast and accurate way due to fast thermal equilibrium established within the sensor.

Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer.