A thermosensitive chip for a composite electrode is provided, including a thermosensitive substrate, wherein each of the two surfaces of the thermosensitive substrate is sequentially provided thereon with a silver electrode and a gold electrode from the inside to the outside in a stacked manner. The thermosensitive chip is suitable for the gold wire bonding technology, the gold electrode on the outer surface thereof facilitates better bonding with a gold wire, and the silver electrode on the bottom of the gold electrode can greatly reduce manufacturing costs. In addition, an operation of coating with gold is conducted through a vacuum sputtering machine, so that the manufacturing process is simple and convenient, and the manufacturing effect is good.

A resistor includes: a first resin protruding part formed in the bottom surface of an exterior material (mold resin body), on an end opposite to a leading side of harness wires along the length of the exterior material near a through-hole piercing an upper surface and a lower surface of the exterior material, and a second resin protruding part, surrounding the circumference of a metal bush embedded in the through-hole and the entire circumference of the resistor substrate. Moreover, a concave part is formed in a region sandwiched between the first resin protruding part and the second resin protruding part.

A resistor includes: a first resin protruding part formed in the bottom surface of an exterior material (mold resin body), on an end opposite to a leading side of harness wires along the length of the exterior material near a through-hole piercing an upper surface and a lower surface of the exterior material, and a second resin protruding part, surrounding the circumference of a metal bush embedded in the through-hole and the entire circumference of the resistor substrate. Moreover, a concave part is formed in a region sandwiched between the first resin protruding part and the second resin protruding part.

A high frequency termination for converting a high frequency electrical signal of a circuit into heat. The high frequency termination includes a substrate. The high frequency termination also includes a spiral resistor formed on the substrate and having a first end and a second end. The high frequency termination also includes a conductive pad electrically coupled to the first end of the spiral resistor. The high frequency termination also includes a contact electrically coupled to the conductive pad and configured to connect to the circuit.

A rotary variable resistor includes an insulating substrate, a resistor pattern and a current collector pattern that are provided on the insulating substrate, a rotor that is mounted on the insulating substrate in a rotatable manner, and a slider that is mounted on the rotor and makes sliding contact with the resistor pattern and the current collector pattern to cause the resistor pattern and the current collector pattern to be conducted to each other. When a maximum dimension of the resistor pattern, which defines a variable resistor, is Z [mm] and electric linearity is L [%], Z≦4.0 and Z×L<10 are satisfied.

A rotary variable resistor includes an insulating substrate, a resistor pattern and a current collector pattern that are provided on the insulating substrate, a rotor that is mounted on the insulating substrate in a rotatable manner, and a slider that is mounted on the rotor and makes sliding contact with the resistor pattern and the current collector pattern to cause the resistor pattern and the current collector pattern to be conducted to each other. When a maximum dimension of the resistor pattern, which defines a variable resistor, is Z [mm] and electric linearity is L [%], Z≦4.0 and Z×L<10 are satisfied.

A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

A thin film resistor formed using thermal spraying techniques in the manufacturing process is provided. A thin film resistor and method of manufacturing a thin film resistor are disclosed including a thermally sprayed resistive element. An alloy bond layer may be applied to a substrate and a thermally sprayed resistive layer is applied to the alloy bond layer by a thermal spraying process to form a thermally sprayed resistive element. The alloy bond layer and the thermally sprayed resistive layer may have the same chemical composition.

A thin film resistor formed using thermal spraying techniques in the manufacturing process is provided. A thin film resistor and method of manufacturing a thin film resistor are disclosed including a thermally sprayed resistive element. An alloy bond layer may be applied to a substrate and a thermally sprayed resistive layer is applied to the alloy bond layer by a thermal spraying process to form a thermally sprayed resistive element. The alloy bond layer and the thermally sprayed resistive layer may have the same chemical composition.

A method of manufacturing an electronic component includes manufacturing a ceramic element including one pair of end surfaces and four side surfaces, forming external electrodes at both end portions of the ceramic element, measuring an initial characteristic value, determining any side surface to be machined among the four side surfaces and then determining, based on stored data, an amount of machining to be performed on the side surface to be machined, and machining, by the determined machining amount, the side surface of the ceramic element, which is determined to be machined, to be flush or substantially flush with the external electrodes.