In general, a varistor including a passivation layer and a method of forming such a varistor are disclosed. The varistor comprises a ceramic body comprising a plurality of alternating dielectric layers and electrode layers. The varistor also comprises a first external terminal on a first end surface and a second external terminal on a second end surface opposite the first end surface wherein at least two side surfaces extend between the first end surface and the second end surface. The varistor also comprises a passivation layer on at least one side surface of the ceramic body between the first external terminal and the second external terminal. The passivation layer includes a phosphate and a metal additive including an alkali metal, an alkaline earth metal, or a mixture thereof. The passivation layer has an average thickness of from 0.1 microns to 30 microns.

In general, a varistor including a passivation layer and a method of forming such a varistor are disclosed. The varistor comprises a ceramic body comprising a plurality of alternating dielectric layers and electrode layers. The varistor also comprises a first external terminal on a first end surface and a second external terminal on a second end surface opposite the first end surface wherein at least two side surfaces extend between the first end surface and the second end surface. The varistor also comprises a passivation layer on at least one side surface of the ceramic body between the first external terminal and the second external terminal. The passivation layer includes a phosphate and a metal additive including an alkali metal, an alkaline earth metal, or a mixture thereof. The passivation layer has an average thickness of from 0.1 microns to 30 microns.

Approaches provided herein include a protection device assembly having a protection component and a first electrode layer extending along a first main side of the protection component. The first electrode layer may include a first section separated from a second section by a first gap. The assembly may further include a second electrode layer extending along a second main side of the protection component, the second electrode layer including a third section separated from a fourth section by a second gap, wherein the first gap is aligned with the second gap. The assembly may further include a first insulation layer disposed over the first electrode layer, and a second insulation layer disposed over the second electrode layer. The assembly may further include a solder pad extending around an end of the protection component, the solder pad further extending over the first insulation layer and the second insulation layer.

A highly reliable surface-mounted resistor, which prevents a problem of disconnection between an electrode and a terminal of a chip resistor when heating during mounting, is disclosed. The surface-mounted resistor includes a chip resistor comprising a plate-shaped substrate, a resistance body formed on an upper surface of the substrate, and an electrode connected the resistance body and drawn from the upper surface of the substrate to a lower surface via an end surface, a plate-shaped lead terminal connected to the electrode of the chip resistor, the plate-shaped lead terminal being fixed to the electrode of the substrate on the lower surface side, and an exterior member covering an entire chip resistor and a part of the lead terminal.

A highly reliable surface-mounted resistor, which prevents a problem of disconnection between an electrode and a terminal of a chip resistor when heating during mounting, is disclosed. The surface-mounted resistor includes a chip resistor comprising a plate-shaped substrate, a resistance body formed on an upper surface of the substrate, and an electrode connected the resistance body and drawn from the upper surface of the substrate to a lower surface via an end surface, a plate-shaped lead terminal connected to the electrode of the chip resistor, the plate-shaped lead terminal being fixed to the electrode of the substrate on the lower surface side, and an exterior member covering an entire chip resistor and a part of the lead terminal.

The invention relates to a shunt resistor (2) for detecting the status of an electrical energy storage unit (1), wherein the shunt resistor (2) comprises a first layer (4), a second layer (6) and a third layer (8). According to the invention, the layers (4, 6, 8) are arranged in a layered manner in a stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers (4, 6, 8) are in physical contact with one another at one of the sides having the greatest respective surface area, and wherein the layers (4, 6, 8) are arranged at least partially overlapping.

The invention relates to a shunt resistor (2) for detecting the status of an electrical energy storage unit (1), wherein the shunt resistor (2) comprises a first layer (4), a second layer (6) and a third layer (8). According to the invention, the layers (4, 6, 8) are arranged in a layered manner in a stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers (4, 6, 8) are in physical contact with one another at one of the sides having the greatest respective surface area, and wherein the layers (4, 6, 8) are arranged at least partially overlapping.

A shunt resistor having sufficient bonding strength includes a resistor, a pair of bases which are integrally formed with the resistor so as to sandwich the resistor, recessed holes which are respectively formed in the bases, and measurement terminals which are inserted into the recessed holes and are affixed to the bases. Each measurement terminal has a shaft part and a flange part that protrudes outwardly in the circumferential direction of the shaft part. Each recessed hole is formed to have a diameter smaller than the diameter of the flange part, and the shaft parts are respectively inserted into the recessed holes.

A shunt resistor having sufficient bonding strength includes a resistor, a pair of bases which are integrally formed with the resistor so as to sandwich the resistor, recessed holes which are respectively formed in the bases, and measurement terminals which are inserted into the recessed holes and are affixed to the bases. Each measurement terminal has a shaft part and a flange part that protrudes outwardly in the circumferential direction of the shaft part. Each recessed hole is formed to have a diameter smaller than the diameter of the flange part, and the shaft parts are respectively inserted into the recessed holes.

In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).