An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.

An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.

A varistor module includes a base, a case, and a varistor body. The base and the case are assembled with each other to form a closed space. The varistor body includes a plurality of ceramic chips and a bridging element. The ceramic chips are disposed in the closed space. Each ceramic chip has an electrode layer on two opposite sides, respectively. The bridging element has at least two bridging segments and a crossing segment. The bridging segments are connected to electrode layers of different ones of the ceramic chips. The crossing segment is disposed between the bridging segments.

A varistor module includes a base, a case, and a varistor body. The base and the case are assembled with each other to form a closed space. The varistor body includes a plurality of ceramic chips and a bridging element. The ceramic chips are disposed in the closed space. Each ceramic chip has an electrode layer on two opposite sides, respectively. The bridging element has at least two bridging segments and a crossing segment. The bridging segments are connected to electrode layers of different ones of the ceramic chips. The crossing segment is disposed between the bridging segments.

In general, a varistor including a passivation layer and a method of forming such a varistor are disclosed. The varistor comprises a ceramic body comprising a plurality of alternating dielectric layers and electrode layers. The varistor also comprises a first external terminal on a first end surface and a second external terminal on a second end surface opposite the first end surface wherein at least two side surfaces extend between the first end surface and the second end surface. The varistor also comprises a passivation layer on at least one side surface of the ceramic body between the first external terminal and the second external terminal. The passivation layer includes a phosphate and a metal additive including an alkali metal, an alkaline earth metal, or a mixture thereof. The passivation layer has an average thickness of from 0.1 microns to 30 microns.

In general, a varistor including a passivation layer and a method of forming such a varistor are disclosed. The varistor comprises a ceramic body comprising a plurality of alternating dielectric layers and electrode layers. The varistor also comprises a first external terminal on a first end surface and a second external terminal on a second end surface opposite the first end surface wherein at least two side surfaces extend between the first end surface and the second end surface. The varistor also comprises a passivation layer on at least one side surface of the ceramic body between the first external terminal and the second external terminal. The passivation layer includes a phosphate and a metal additive including an alkali metal, an alkaline earth metal, or a mixture thereof. The passivation layer has an average thickness of from 0.1 microns to 30 microns.

An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

The present invention provides an apparatus having a protecting element for protecting the apparatus in an emergency, wherein the protecting element is a polymer PTC element, the polymer PTC element has a polymer PTC member, and the polymer PTC member is formed from a polymer composition containing a polyvinylidene fluoride as a main component.

A green film composed of varistor material laminated on a ceramic main body, which is provided with metallizations on both sides, and is sintered to form a varistor layer. A terminating electrode pair completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair can serve directly as a terminal contact for mounting an electrical component.