In an embodiment an electrical component includes an electrical resistor having a PTC ceramic with a reference temperature exceeding 150° C., wherein, at the reference temperature, a reference resistance is twice an amount of a minimum resistance of the PTC ceramic.

A surge protection device includes a metal terminal and a spring. The metal terminal is located between two metal oxide varistors, where the metal terminal extends beyond the metal oxide varistors. The spring has a flat surface that is connected to the metal terminal using a soldering paste. The flat surface has a bend on one end which forms a gap between the flat surface and the metal terminal.

A surge protection device includes a metal terminal and a spring. The metal terminal is located between two metal oxide varistors, where the metal terminal extends beyond the metal oxide varistors. The spring has a flat surface that is connected to the metal terminal using a soldering paste. The flat surface has a bend on one end which forms a gap between the flat surface and the metal terminal.

The present invention provides an apparatus having a protecting element for protecting the apparatus in an emergency, wherein the protecting element is a polymer PTC element, the polymer PTC element has a polymer PTC member, and the polymer PTC member is formed from a polymer composition containing a polyvinylidene fluoride as a main component.

Provided are an electric shock protection device and method of manufacturing the same. The electric shock protection device may include a capacitor unit comprising multiple sheet layers and multiple capacitor electrodes provided on the sheet layers and has an electric shock prevention function and a communication signal transmission function; a pair of soldering electrodes formed on the sheet layer disposed at an outermost side among the sheet layers, extend from both ends toward a center of the capacitor unit, and are formed as electrodes for co-firing; a pair of terminal electrodes provided at both ends of the sheet layers and connecting the capacitor electrodes to the pair of soldering electrodes; a varistor connected to the pair of soldering electrodes through solders and formed as a single component; and a molding portion molded on the varistor, the pair of soldering electrodes, and one side of each of the terminal electrodes.

The present invention provides a bottom ohmic silver paste for strontium titanate ring varistor including silver powder, doped SnO.sub.2 micro powder, glass powder, organic solvent and organic binder, and the mass ratio of the silver powder, the doped SnO.sub.2 micro powder, the glass powder, the organic solvent and the organic binder is [65,85]:[0.9,4.3]:[0.5,5]:[10,20]:[10,15]. The present invention also provides a preparation method and use of the bottom ohmic silver paste for strontium titanate ring varistor of the present invention.

The present invention provides a bottom ohmic silver paste for strontium titanate ring varistor including silver powder, doped SnO.sub.2 micro powder, glass powder, organic solvent and organic binder, and the mass ratio of the silver powder, the doped SnO.sub.2 micro powder, the glass powder, the organic solvent and the organic binder is [65,85]:[0.9,4.3]:[0.5,5]:[10,20]:[10,15]. The present invention also provides a preparation method and use of the bottom ohmic silver paste for strontium titanate ring varistor of the present invention.

An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.

A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

In some embodiments, a multi-layer electrical device can include multiple electrodes connected to respective terminals, with at least two selected terminals being configured to allow movement relative to each other to accommodate a change in separation distance of the respective electrodes resulting from a change in temperature, and to allow a solder to provide a connection therebetween when the multi-layer electrical device is soldered on a mounting surface. In some embodiments, the multi-layer electrical device can further include a layer having a temperature-dependent electrical property implemented between each neighboring pair of electrodes.