A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface. The second layer, covering a part of the first layer, is made of a material containing metal particles and synthetic resin.

A chip resistor structure includes a substrate; a pair of first electrodes disposed opposite to each other on a first surface of the substrate at a first interval; a resistance layer disposed between the pair of first electrodes on the first surface; a spacer layer made of a material having a composition different from that of the resistance layer, disposed over the pair of first electrodes; a protective layer overlying the resistance layer; and a plating layer electroplated onto the pair of first electrodes and the spacer layer, and having ends extending beyond the pair of first electrodes terminate at least over the spacer layer. The plating layer may be joined with or spaced from or climb up to the protective layer on or above the spacer layer.

A shunt resistor (1) includes: a resistance element (3); a first electrode (5A) and a second electrode (5B) coupled to both sides of the resistance element (3); a first fusion material (6A) and a second fusion material (6B) electrically coupled to the first electrode (5A) and the second electrode (5B), respectively, the first fusion material (5A) and the second fusion material (5B) haying electric conductivity; and at least one board (10) coupled to the first electrode (5A) and the second electrode 15B) by the first fusion material (6A) and the second fusion material (6B). The first fusion material (6A) is arranged in a first through-hole (7A) formed in the first electrode (5A) or the board (10), and the second fusion material (6B) is arranged it as second through-hole (7B) formed in the second electrode (5B) or the board (10).

A multilayer varistor of the present disclosure includes a sintered body, a first internal electrode, a second internal electrode, a first external electrode, a second external electrode, and a high-resistance layer. The first internal electrode and the second internal electrode are disposed in the sintered body. The first external electrode is disposed on a surface of the sintered body and is electrically connected to the first internal electrode. The second external electrode is disposed on the surface of the sintered body and is electrically connected to the second internal electrode. The high-resistance layer covers at least part of the surface of the sintered body, and the high-resistance layer has a surface having a plurality of cracks.

Provided is a shunt resistor with an enhanced strength and reduced electrical resistance between a resistive element and terminals of the shunt resistor. This shunt resistor includes a first terminal and a second terminal each made of an electrically conductive metal material; and a resistive element disposed between the first terminal and the second terminal. The first terminal and the second terminal each have a through-hole, and the resistive element is embedded in the through-holes of the first terminal and the second terminal in a depth direction thereof. Regions connecting the resistive element to the first terminal and the second terminal each have an alloy portion formed along an inner peripheral surface of the through-hole.

Provided is a shunt resistor with an enhanced strength and reduced electrical resistance between a resistive element and terminals of the shunt resistor. This shunt resistor includes a first terminal and a second terminal each made of an electrically conductive metal material; and a resistive element disposed between the first terminal and the second terminal. The first terminal and the second terminal each have a through-hole, and the resistive element is embedded in the through-holes of the first terminal and the second terminal in a depth direction thereof. Regions connecting the resistive element to the first terminal and the second terminal each have an alloy portion formed along an inner peripheral surface of the through-hole.

A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.

A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.

To provide a wire-wound resistor provided with high reliability and that retains the basic functionality of the wire-wound resistor, and a method for manufacturing the same. A wire-wound resistor in which a resistor wire is wound onto an external periphery of a core (11) obtained by bundling fibrous insulators, and a connection terminal (13) is attached to both ends of the core (11) and connected to the resistor wire (12a), wherein the core (11) is impregnated with a binder in the portion (11a) in the vicinity of the external periphery. The binder (1) is preferably not included in a center portion (11b) of the core (11).

To provide a wire-wound resistor provided with high reliability and that retains the basic functionality of the wire-wound resistor, and a method for manufacturing the same. A wire-wound resistor in which a resistor wire is wound onto an external periphery of a core (11) obtained by bundling fibrous insulators, and a connection terminal (13) is attached to both ends of the core (11) and connected to the resistor wire (12a), wherein the core (11) is impregnated with a binder in the portion (11a) in the vicinity of the external periphery. The binder (1) is preferably not included in a center portion (11b) of the core (11).