The present invention relates to a shunt resistor and a method for manufacturing the shunt resistor. The present invention relates to a current detection device including a shunt resistor. The shunt resistor (1) comprises a resistance element (5) and a pair of electrodes (6, 7) connected to both ends (5a, 5b) of the resistance element (5) in a first direction. The shunt resistor (1) has a projecting portion (11) formed on a side surface (1a), which is parallel to the first direction, of the shunt resistor (1), and a recessed portion (12) formed in a side surface (1b), which is an opposite side of the side surface (1a), of the shunt resistor (1), and extending in the same direction as the projection (11). The projecting portion (11) has a portion of the resistance element (5) and portions of the pair of electrodes (6, 7), and the recessed portion (12) has a side surface (5d) of the resistance element (5) parallel to the first direction.

To provide a chip resistor in which a resistive element can be surely protected from an external environment and which is also excellent in corrosion resistance, a chip resistor 1 is configured to include an insulating substrate 2, a pair of front electrode 3 provided on opposite end portions of a front surface of the insulating substrate 2, a pair of back electrodes 7 provided on opposite end portions of a back surface of the insulating substrate 2, a resistive element 4 provided to extend onto the two front electrodes 3, a first insulating layer 5 covering the resistive element 4, a second insulating layer 6 made of a resin material to cover the first insulating layer 5, end surface electrodes 8 establishing electrical continuity between the front electrodes 3 and the back electrodes 7, plating layers 9 covering the end surface electrodes 8, etc. Rough surface portions 6a made rougher in surface roughness than any other portion of the second insulating layer 6 are formed at opposite end portions of the second insulating layer 6. End portions of the end surface electrodes 8 and the plating layers 9 are brought into tight contact with the rough surface portions 6a respectively.

Provided is a current detecting device comprising a current detecting resistor including a pair of electrodes and a resistive element; a pair of lands on which the current detecting resistor is adapted to be mounted; connection portions adapted to connect the two electrodes and the two lands, respectively; and a pair of wires connected to the two respective electrodes and adapted to detect a voltage. Positions where the two wires are connected to the two respective electrodes are located in regions on a further inner side than inner ends of the connection portions.

Provided is a current detecting device comprising a current detecting resistor including a pair of electrodes and a resistive element; a pair of lands on which the current detecting resistor is adapted to be mounted; connection portions adapted to connect the two electrodes and the two lands, respectively; and a pair of wires connected to the two respective electrodes and adapted to detect a voltage. Positions where the two wires are connected to the two respective electrodes are located in regions on a further inner side than inner ends of the connection portions.

A multilayer ceramic electronic component has a dimension in a longitudinal direction of no less than about 0.12 mm and no more than about 0.27 mm, a dimension in a width direction of no less than about 0.06 mm and no more than about 0.14 mm, and a dimension in a lamination direction of no less than about 0.06 mm and no more than about 0.14 mm, for example. Each of a first outer electrode and a second outer electrode includes an underlying electrode layer disposed on a surface of a multilayer body, a nickel-plated layer covering the underlying electrode layer, and a tin-plated layer covering the nickel-plated layer. The nickel-plated layer in each of the first outer electrode and second outer electrode has surface roughness of no less than about 3 μm and no more than about 6 μm, for example.

A circuit board structure includes a multi-layer board and a ceramic resistor embedded in the multi-layer board. The ceramic resistor includes a ceramic sheet, a plurality of connecting pads spacedly arranged on the ceramic sheet, and a plurality of resistance layers arranged on the ceramic sheet. At least one of the resistance layers is arranged between and electrically connected to any two of the connecting pads for providing a resistance value. The number of the resistance values provided by the ceramic resistor is more than the number of the resistance layers. The multi-layer board has a plurality of contacts arranged apart from each other, and the contacts are respectively and electrically connected to the connecting pads.

An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

A component having an active volume, the active volume not being centrally positioned along a height of the component, and/or not being centrally positioned along a width of the component. Use of the component is also disclosed. Further aspects relate to a use of the component and to a component. The component can be an NTC thermistor or a PTC thermistor or a temperature measurement element. Use of the component for monitoring a temperature of a battery or in a vehicle is also disclosed.