A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

Aspects of the subject disclosure may include, for example, a system having a first plurality of transmitters for launching according to a signal, first electromagnetic waves, and a second plurality of transmitters for launching, according to the signal, second electromagnetic waves. The first electromagnetic waves and the second electromagnetic waves combine at an interface of a transmission medium to induce a propagation of a third electromagnetic wave, the third electromagnetic wave having a non-fundamental wave mode and a non-optical operating frequency, and wherein the second plurality of transmitters are spaced apart from the first plurality of transmitters in a direction of propagation of the third electromagnetic wave. Other embodiments are disclosed.

The monitoring of an electrical equipment item includes two electrically insulated circuits, a screen in the form of a film arranged between the two circuits, the screen comprising a substrate and a conductive filament arranged on the substrate, a module configured to circulate a current in the conductive filament and to monitor the current.

The monitoring of an electrical equipment item includes two electrically insulated circuits, a screen in the form of a film arranged between the two circuits, the screen comprising a substrate and a conductive filament arranged on the substrate, a module configured to circulate a current in the conductive filament and to monitor the current.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

Internal electrodes, a protective film, and protective films covering the top parts of internal electrode sides of lead wires are formed on a top surface of a substrate of a temperature sensor element, thereby making the overall shape a quadrangular prism and the transverse cross-section nearly a square even at any portion in the axial direction. A heating part of the temperature sensor element is provided near the center along the length, the height, and the width of the element, thereby preventing deviation of heat generation and stabilizing heat release to the lead wires. This allows the temperature sensor element to suppress fluctuation in detected temperatures due to mounting angle.

An object is to provide a chip resistor capable of coping with high power. A chip resistor of the present disclosure includes insulating substrate, a pair of electrodes, and resistance member. A pair of electrodes are provided at both ends of the upper face of insulating substrate. Resistance member is provided on insulating substrate and connected to the pair of electrodes. Insulating substrate has first region in the center thereof and second regions at both ends of first region. Recess is provided in first region of insulating substrate. Resistance member formed in first region has a meandering shape in a top view. At least a part of resistance member is embedded in recess. Trimming groove is provided in resistance member formed in second region.