An electronic component includes a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au—Sn alloy layer formed on at least one of the glass-containing Au layers; the electronic component further includes a pure-Au layer between the glass-containing Au layer and the Au—Sn alloy layer; furthermore, the Au—Sn alloy layer has an Au—Sn eutectic structure.

A composite circuit protection device includes: a positive temperature coefficient (PTC) component which includes a positive temperature coefficient (PTC) layer that has two opposite surfaces, and first and second electrode layers that are respectively disposed on the two opposite surfaces of the PTC layer; a diode component that is connected to the second electrode layer of the PTC component; a first conductive lead that is bonded to the first electrode layer of the PTC component; and a second conductive lead that is bonded to the diode component. The PTC component has a rated voltage that ranges between 50% and 250% of a breakdown voltage of the diode component as determined at 1 mA.

In an embodiment, a component includes a first electrode and a second electrode arranged one above the other in a stacking direction, wherein the first electrode and the second electrode overlap in a first overlap region, wherein the first electrode has, in a first region containing the first overlap region, an extent in a first direction perpendicular to the stacking direction that is greater than an extent of the second electrode in the first direction in the first region, and wherein the first electrode has, in the first region containing the first overlap region, an extent in a second direction perpendicular to the stacking direction and to the first direction that is greater than an extent of the second electrode in the second direction in the first region, and a third electrode arranged in the same plane as the second electrode, wherein the first electrode is a floating electrode, wherein the first electrode and the third electrode overlap in a second overlap region, wherein the first electrode has, in a second region that contains the second overlap region, extents in the first direction and in the second direction that are greater than the extents of the third electrode in the first and the second direction in the second region, and wherein the first electrode has, in a connecting region that connects the first region and the second region, an extent in the first direction that is smaller than the extent of the first electrode in the first region and smaller than the extent of the first electrode in the second region.

A PTC heating element and an electric heating device containing such a PTC heating element are disclosed. The PTC heating element comprises two insulating layers with a metallic coating provided on one side and a PTC element arranged therebetween which is provided on oppositely disposed main side surfaces with a respective metallization which is electrically conductively connected to the coating of one of the insulating layers. The metallization provided on one of the main side surfaces is assigned only to one potential for energizing the PTC element. The metallization provided on the other main side surface is assigned to only the other potential for energizing the PTC element. The metallization of the one main side surface of the PTC element and the metallization of the other main side surface of the PTC element are formed in such a way that the current path (P) through the PTC element is extended relative to the thickness (D) of the PTC element.

A surface-mounted polymer PTC overcurrent protection element having a small package size, comprising a PTC chip, an insulating layer (30), end electrodes (41, 42), and at least one conductive member (60). A dividing gap is designed on a first conductive electrode (21) to form first and second conductive areas (211, 212); the conductive member (60) is arranged at the edge or at least a corner of the first conductive area (211) side of the PTC chip, is used for conducting the first conductive area (211) and a second conductive electrode (22) on the PTC chip, and is not in contact with the end electrodes (41, 42); the main portion comprised in the dividing gap (70) of the first conductive electrode (21) is parallel to the longitudinal direction of the first end electrode (41) and the second end electrode (42). Also provided is a preparation method for the protection element. Thus, the miniaturized overcurrent protection element can satisfy the current PCB process to achieve requirements of mass production. It is convenient to design an overcurrent protection element resistance scheme, and reduce adjustment of a PTC core material formulation.

A pPTC heating device having areas with different power densities distributed over the surface of the device. The device is constructed using a base layer composed of a pPTC material having a layer of sectioned conductive plates disposed over and under the layer of pPTC such as to control the path of the current through the device, thereby controlling resistance of the device and the power density of the device.

A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.

APTC heating assembly includes contact elements and a cuboid ceramic component on which a metallization is applied. The ceramic component comprises mutually opposing main side surfaces for heat dissipation which are larger by at least a factor of five than each of the end faces extending between the main side surfaces. The contact elements are electrically conductively connected to the metallization for introducing the power current into the ceramic component. The metallization is formed only on the main side surfaces and is in the form of elongated metallization strips. The metallization strips extend along mutually opposite edges of the cuboid ceramic component, are each assigned to one polarity, are separated by a single end face, and are connected to a power source via a common contact element.

In some embodiments, a multi-layer electrical device can include multiple electrodes connected to respective terminals, with at least two selected terminals being configured to allow movement relative to each other to accommodate a change in separation distance of the respective electrodes resulting from a change in temperature, and to allow a solder to provide a connection therebetween when the multi-layer electrical device is soldered on a mounting surface. In some embodiments, the multi-layer electrical device can further include a layer having a temperature-dependent electrical property implemented between each neighboring pair of electrodes.

A pPTC heating device having areas with different power densities distributed over the surface of the device. The device is constructed using a base layer composed of a pPTC material having a layer of sectioned conductive plates disposed over and under the layer of pPTC such as to control the path of the current through the device, thereby controlling resistance of the device and the power density of the device.