Patent classifications
H01C7/041
NTC thermistor element
An NTC thermistor element is of less than 0402 size. A first internal electrode is connected to a first external electrode. A second internal electrode is separated from the first internal electrode and is connected to a second external electrode. A third internal electrode opposes the first and second internal electrodes and is not connected to the first external electrode and the second external electrode. A shortest distance between the first internal electrode and the third internal electrode and a shortest distance between the second internal electrode and the third internal electrode are smaller than a shortest distance between the first internal electrode and the second internal electrode, a shortest distance between the first external electrode and the third internal electrode, and a shortest distance between the second external electrode and the third internal electrode, and are less than or equal to ¼ the thickness of the thermistor body.
Circuit protection device
The present invention relates to a circuit protection device including: a device comprising a heating element configured to comprise a body and a pair of electrodes formed on the body, and a pair of lead wires connected, respectively, to the pair of electrodes; and a case having an independent accommodating space formed therein to accommodate at least the heating element, wherein the case includes at least one heat insulating layer disposed in the vicinity of the accommodating space.
Sensor device and method for manufacturing a sensor device
In an embodiment a sensor device includes a sensor chip having a plurality of printed ceramic layers and unprinted ceramic layers, at least one termination layer configured to make electrical contact with an electrically conductive material, wherein the termination layer is formed at least on a top side and/or on a bottom side of the sensor chip, wherein the printed ceramic layers are at least partially printed with an electrically conductive material, and wherein an electrical resistance of the sensor chip is determined by an overlap area of the electrically conductive material or by a distance of the electrically conductive material from the termination layer and at least one damping layer directly located at at least a partial area of an outer surface of the sensor chip, wherein the damping layer includes a material which has a greater elasticity than a material of the termination layer.
Sensor Element and Method for Manufacturing a Sensor Element
In an embodiment a sensor element includes a carrier having an electrically insulating material, a top side and a bottom side, an NTC thermistor arranged on the top side of the carrier and at least two first electrodes configured for electrically contacting the sensor element, wherein the first electrodes are arranged on the top side of the carrier, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration in an electrically insulating manner.
Sensor Element and Method for Producing a Sensor Element
In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.
NTC THERMISTOR ELEMENT
An NTC thermistor element is of less than 0402 size. A first internal electrode is connected to a first external electrode. A second internal electrode is separated from the first internal electrode and is connected to a second external electrode. A third internal electrode opposes the first and second internal electrodes and is not connected to the first external electrode and the second external electrode. A shortest distance between the first internal electrode and the third internal electrode and a shortest distance between the second internal electrode and the third internal electrode are smaller than a shortest distance between the first internal electrode and the second internal electrode, a shortest distance between the first external electrode and the third internal electrode, and a shortest distance between the second external electrode and the third internal electrode, and are less than or equal to ¼ the thickness of the thermistor body.
Sensor Device and Method for Manufacturing a Sensor Device
In an embodiment a sensor device includes a sensor chip having a plurality of printed ceramic layers and unprinted ceramic layers, at least one termination layer configured to make electrical contact with an electrically conductive material, wherein the termination layer is formed at least on a top side and/or on a bottom side of the sensor chip, wherein the printed ceramic layers are at least partially printed with an electrically conductive material, and wherein an electrical resistance of the sensor chip is determined by an overlap area of the electrically conductive material or by a distance of the electrically conductive material from the termination layer and at least one damping layer directly located at at least a partial area of an outer surface of the sensor chip, wherein the damping layer includes a material which has a greater elasticity than a material of the termination layer.
CIRCUIT PROTECTION DEVICE
The present invention relates to a circuit protection device including: a device comprising a heating element configured to comprise a body and a pair of electrodes formed on the body, and a pair of lead wires connected, respectively, to the pair of electrodes; and a case having an independent accommodating space formed therein to accommodate at least the heating element, wherein the case includes at least one heat insulating layer disposed in the vicinity of the accommodating space.
Electronic component for limiting the inrush current
An electronic component is disclosed. In an embodiment, an electronic component includes at least one NTC element and at least two electrically conductive contact elements, wherein the NTC element is electrically conductively connected to a respective contact element via a connection material, and wherein a coefficient of thermal expansion of the contact elements is adapted to a coefficient thermal expansion of the NTC element.
THERMISTOR AND METHOD FOR PRODUCING SAID THERMISTOR
A thermistor having a ceramic main body, which contains a ceramic material as the main constituent. The ceramic main body has at least one electrically insulating layer. The electrically insulating layer is arranged within the ceramic main body and contains a main component which has a composition different from the ceramic material.