Patent classifications
H01C17/26
SULFURIZATION DETECTION RESISTOR AND MANUFACTURING METHOD THEREFOR
A sulfurization detection resistor makes it possible to detect a degree of sulfurization accurately and easily, and a manufacturing method for such sulfurization detection resistor. A sulfurization detection resistor includes an insulated substrate having a rectangular parallelepiped shape, a first front electrode and a second front electrode formed at both ends on a main surface of the insulated substrate, multiple sulfurization detecting conductors connected in parallel to the first front electrode, multiple resistive elements connected between the sulfurization detecting conductors and the second front electrode, and a protective film formed to partially cover the sulfurization detecting conductors and entirely cover the resistive elements. The sulfurization detecting conductors have their sulfurization detecting portions exposed out of the protective film, and different timings are set for these sulfurization detecting portions respectively to become disconnected depending on a cumulative amount of sulfurization.
THREE-DIMENSIONAL PRINTING
In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.
Calibration system and calibrating method
A calibration system adapted to calibrate a resistance of an electrical device having a lead wire comprises a resistance detector adapted to detect the resistance of the electrical device, a first container containing an etching solution adapted to etch the lead wire, and a heater configured to heat the electrical device. If a first resistance of the electrical device detected by the resistance detector at a first temperature is within a first predetermined range, the electrical device is heated with the heater to a second temperature higher than the first temperature. A second resistance of the electrical device is detected by the resistance detector at the second temperature. If the second resistance is beyond a second predetermined range, the lead wire is etched by the etching solution to adjust the resistance of the electrical device until the second resistance at the second temperature is within the second predetermined range.
Symmetrically tunable electrical resistor
An electrical resistor element, system, and method related thereto, wherein the electrical resistor element includes a tunable resistance. The electrical resistor element comprises a first contact electrode, a second contact electrode and a ferroelectric layer arranged between the first contact electrode and the second contact electrode. The ferroelectric layer comprises a first area having a first polarization direction and a second area having a second polarization direction. The first polarization direction is different to the second polarization direction. The ferroelectric layer further comprises a domain wall between the first area and the second area. The electrical resistor element further comprises a first pinning element configured to stabilize the first polarization direction of the ferroelectric layer. The electrical resistor element further comprises a control circuit configured to tune the resistance of the electrical resistor element by applying electrical pulses to the ferroelectric layer such that the ferroelectric domain wall is moved.
Chip parts
A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.
ON-CHIP RESISTOR TRIMMING TO COMPENSATE FOR PROCESS VARIATION
A resistance trimming circuit has a resolution of N=X+Y bits. Included is a first circuit with M resistors, where M=2.sup.X1, with each of the M resistors having a resistance of R*(2.sup.Y)*i, i being an index having a value ranging from 1 to 2.sup.X1. M switches are associated with the M resistors. Each of the M resistors is coupled between a first node and its one of the M switches, and each of the M switches couples its one of the M resistors to a second node. Included is a second circuit with P resistors, where P=2.sup.Y1, with each of the P resistors having a resistance of R*i. P switches are associated with the P resistors. Each of the P resistors is coupled between the second node and its one of the P switches, and each of the P switches selectively couples its one of the P resistors to a third node.
Trimming method of DCR sensing circuits
A circuit and method provide improved trimming of a DCR sensing circuit where a sensing element is sensitive to self-heating or having a large tolerance. The circuit includes a resistive divider circuit coupled to a sensing element. The resistive divider circuit includes a trim resistor and two test points. Prior to trimming the trim resistor, an actual resistance of the sensing element is determined. A target voltage across the trim resistor to be trimmed is calculated according to the determined sensing element resistance and a known small trim current that is to be injected into the circuit during the trimming process. This injected trim current has a low current value so there is no self-heating of the sensing element. Then, the trim resistor is trimmed while injecting this small trim current into the resistive divider circuit and the voltage across the trim resistor is monitored.
Multilayer Stack with Enhanced Conductivity and Stability
An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
Multilayer stack with enhanced conductivity and stability
An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
Multilayer stack with enhanced conductivity and stability
An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.