A coil component includes: a body containing magnetic metal particles and an insulating resin; a coil portion disposed in the body; and first and second external electrodes disposed on the body while being spaced apart from each other and connected to opposite end portions of the coil portion, respectively, wherein a surface of the body has first and second regions in which the first and second external electrodes are disposed, respectively, and a third region in which the first and second external electrodes are not disposed, some of the magnetic metal particles are exposed to the third region of the body, and a monomolecular organic material having a hydrophobic portion is disposed at an exposed surface of the magnetic metal particle exposed to the third region of the body.

A semiconductor device includes a die having an input port and an output port. The semiconductor device also includes a multilayer package substrate with pads on a surface of the multilayer package substrate configured to be coupled to circuit components of a printed circuit board. The multilayer package substrate also includes a passive filter comprising an input port and an output port, and a planar inductor. The planar inductor is coupled to a given pad of the pads of the multilayer package substrate with a first via of the multilayer package substrate and to the input port of the die with a second via of the multilayer package substrate. The planar inductor extends parallel to the surface of the multilayer package substrate.

A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.

A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the first conductive line. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap. The semiconductor device structure includes a second conductive line over the conductive via structure and the first photosensitive dielectric layer. The semiconductor device structure includes a second protection cap over the second conductive line. The semiconductor device structure includes a second photosensitive dielectric layer over the first photosensitive dielectric layer, the second conductive line, and the second protection cap.

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.

A coil component according to one embodiment of the present invention includes: a base body having a plurality of magnetic layers; a first external electrode provided on the base body; a second external electrode provided on the base body and spaced from the first external electrode; a coil conductor provided in the base body; a first lead-out conductor including a first lead-out conductor first pattern and a first lead-out conductor second pattern; and a second lead-out conductor connecting a second end of the coil conductor and the second external electrode. The first lead-out conductor first pattern is provided between the magnetic layers so as to be connected to a first end of the coil conductor and the first external electrode. The first lead-out conductor second pattern is provided between the magnetic layers so as to be connected to the first lead-out conductor first pattern and the first external electrode.

An inductor structure includes a first curve metal component, a second curve metal component, a connection component, and a capacitor. The first and the second curve metal components are disposed on a layer. The layer is located at a first plane, the first and the second curve metal components are located at a second plane. The connection component is coupled to the first curve metal component and the second curve metal component. A first terminal of the connection component is coupled to a first terminal of the first curve metal component. A second terminal of the connection component is coupled to a first terminal of the second curve metal component. A first terminal of the capacitor is coupled to a second terminal of the first curve metal component. A second terminal of the capacitor is coupled to a second terminal of the second curve metal component.

A coil component includes a first coil and a second coil that magnetically couples with the coil and causes a negative inductance to be generated. The coil component further includes an electrode that is provided at a position adjacent to or in the vicinity of a port of each of the first and second coils.

A coil component includes a body; a supporting substrate embedded in the body; a coil portion including a coil pattern, and a lead-out pattern exposed to an outside of the body through an external surface of the body, and disposed on the supporting substrate and embedded in the body; and an insulating film disposed between the coil portion and the body, wherein at least a portion of the lead-out pattern contacts the body through an opening formed in the insulating film.

A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.