Radio frequency weak magnetic field detection sensor and method of manufacturing the same
11699549 · 2023-07-11
Assignee
- Electronics And Telecommunications Research Institute (Daejeon, KR)
- Korea Advanced Institute Of Science And Technology (Daejeon, KR)
Inventors
- Jang Yeol Kim (Daejeon, KR)
- In Kui Cho (Daejeon, KR)
- Hyunjoon Lee (Busan, KR)
- Sang-Won Kim (Daejeon, KR)
- Seong-Min Kim (Daejeon, KR)
- Jung Ick Moon (Daejeon, KR)
- Woo Cheon Park (Daejeon, KR)
- Je Hoon Yun (Daejeon, KR)
- Jaewoo Lee (Daejeon, KR)
- Ho Jin Lee (Daejeon, KR)
- Dong Won Jang (Daejeon, KR)
- Kibeom Kim (Chungju-si, KR)
- Seungyoung Ahn (Daejeon, KR)
Cpc classification
H01F17/045
ELECTRICITY
H01F17/0033
ELECTRICITY
International classification
G01R33/02
PHYSICS
Abstract
A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.
Claims
1. A radio frequency (RF) weak magnetic field detection sensor comprising: a ferromagnetic core; a pickup coil disposed to surround the ferromagnetic core; a substrate having an opening, a core pad connected to the ferromagnetic core, and a coil pad connected to the pickup coil; and an insulating tube interposed between the ferromagnetic core and the pickup coil, wherein the insulating tube comprises: a bobbin around which the pickup coil is wound; and a core hole formed to pass through the bobbin, the core hole being configured to accommodate the ferromagnetic core, wherein a plurality of core holes are formed to pass through the bobbin in parallel and spaced apart from each other, wherein the pickup coil comprises: a first winding portion wound in a direction from one end of the bobbin toward another end of the bobbin; and a second winding portion wound in a direction opposite to the first winding portion, wherein the substrate further comprises: an input pad connected to the core pad on one side surface of the substrate, and grounded on another side surface of the substrate; and an output pad connected to the coil pad on the one side surface of the substrate, and grounded on the other side surface of the substrate.
2. The RF weak magnetic field detection sensor of claim 1, wherein the ferromagnetic core comprises a plurality of amorphous wires formed with an insulating coating on a surface thereof and accommodated side by side in the core hole.
3. The RF weak magnetic field detection sensor of claim 1, wherein opposite ends of the ferromagnetic core are formed with a plating portion that is formed of gold or silver and that is bonded to the core pad.
4. The RF weak magnetic field detection sensor of claim 1, wherein the substrate has a via hole connected to the core pad or the coil pad on the one side surface and grounded on the other side surface through the substrate.
5. The RF weak magnetic field detection sensor of claim 4, wherein a region other than the core pad, the coil pad, the input pad, and the output pad is grounded on the one side surface of the substrate.
6. The RF weak magnetic field detection sensor of claim 1, wherein a direction of an excitation magnetic field formed in the ferromagnetic core and a direction of an external magnetic field are perpendicular to each other.
7. The RF weak magnetic field detection sensor of claim 1, further comprising: an excitation coil wound around the ferromagnetic core, wherein a direction of an excitation magnetic field formed in the ferromagnetic core and a direction of an external magnetic field are parallel to each other.
8. A radio frequency (RF) weak magnetic field detection sensor comprising: a ferromagnetic core; a pickup coil disposed to surround the ferromagnetic core; an insulating tube interposed between the ferromagnetic core and the pickup coil; and a substrate, wherein the insulating tube comprises: a bobbin around which the pickup coil is wound; and a plurality of core holes formed to pass through the bobbin in parallel and spaced apart from each other, the core holes being configured to accommodate the ferromagnetic core, wherein the substrate comprises: an opening; a core pad connected to the ferromagnetic core; a coil pad connected to the pickup coil; an input pad connected to the core pad on one side surface of the substrate, and grounded on another side surface of the substrate; and an output pad connected to the coil pad on the one side surface of the substrate, and grounded on the other side surface of the substrate, wherein the pickup coil comprises: a first winding portion wound in a direction from one end of the bobbin toward another end of the bobbin; and a second winding portion wound in a direction opposite to the first winding portion.
9. The RF weak magnetic field detection sensor of claim 8, wherein the substrate comprises a via hole connected to the core pad or the coil pad on one side surface thereof and grounded on another side surface thereof through the substrate.
10. The RF weak magnetic field detection sensor of claim 8, wherein the ferromagnetic core comprises a plurality of amorphous wires formed with an insulating coating on a surface thereof and accommodated side by side in the core hole.
11. The RF weak magnetic field detection sensor of claim 8, wherein opposite ends of the ferromagnetic core are formed with a plating portion that is formed of gold or silver and that is bonded to the core pad.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) These and/or other aspects, features, and advantages of the invention will become apparent and more readily appreciated from the following description of example embodiments, taken in conjunction with the accompanying drawings of which:
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DETAILED DESCRIPTION
(10) Hereinafter, example embodiments will be described in detail with reference to the accompanying drawings. The scope of the right, however, should not be construed as limited to the example embodiments set forth herein. Various modifications may be made to the example embodiments. Here, examples are not construed as limited to the example embodiments and should be understood to include all changes, equivalents, and replacements within the idea and the technical scope of the example embodiments. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the,” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood. that the terms “comprises,” “comprising,” “includes,” and/or “including,” when used herein, specify the presence of stated features, integers, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components, and/or groups thereof.
(11) Although terms such as “first,” “second,” and “third” may be used herein to describe various members, components, regions, layers, or sections, these members, components, regions, layers, or sections are not to be limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or section from another member, component, region, layer, or section. Thus, a first member, component, region, layer, or section referred to in examples described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the examples.
(12) Unless otherwise defined, all terms, including technical and scientific terms, used herein have the same meaning as commonly understood by those skilled in the art to which the example embodiments pertain. Terms, such as those defined in commonly used dictionaries, are to be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art, and are not to be interpreted in an idealized or overly formal sense unless expressly so defined herein.
(13) Regarding the reference numerals assigned to the components in the drawings, it should be noted that the same components will be designated by the same reference numerals, wherever possible, even though they are shown in different drawings. Also, in the description of example embodiments, detailed description of well-known related structures or functions will be omitted when it is deemed that such description will cause ambiguous interpretation of the example embodiments.
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(15) Referring to
(16) The soft magnetic material may have characteristics such as a low coercivity in a hysteresis curve indicating a change in a magnetic flux caused by a magnetic material that is magnetized in response to a change in an external magnetic field, and a small magnetic loss caused by high saturation magnetization and high permeability. The representative soft magnetic material may include MnZn and NiZn soft ferrites, permalloy (Ni80% Fe20%) alloy, cobalt and Fe amorphous metals, and the like. The soft magnetic material may have high permeability. In this example embodiment, a soft ferrite and a cobalt amorphous metal may be used as a ferromagnetic core, and other soft magnetic materials such as permalloy alloy and the like may be used in place of the soft ferrite and the cobalt amorphous metal.
(17) Referring to a process from 1 to 2a of
(18) The ferromagnetic core 101 may be formed of the soft magnetic material, for example, a cobalt amorphous wire, and may have a circular cross section having a diameter of 100 μm. When the pickup coil 103a is formed by winding a coil in a manner of directly surrounding the amorphous wire, a high permeability characteristic may be broken due to stress of the amorphous wire, and magnetization may not be properly performed. In addition, when the coil is directly wound around the amorphous wire, the amorphous wire may be cut off or a winding coil may be cut off during a winding process. Thus, it may be difficult to implement the sensor, or a sensitivity characteristic may tend to deteriorate.
(19) Therefore, in order to solve such problems, the insulating tube 102 may be interposed between the ferromagnetic core 101 and the pickup coil 103a without directly winding the coil around the amorphous wire. The insulating tube 102 may include a bobbin 102a around which the pickup coil 103a is wound, and a core hole 102b formed to pass through the bobbin 102a so as to accommodate the ferromagnetic core 101.
(20) The pickup coil 103a may be formed by winding the coil on the bobbin 102a. The bobbin 102a may be formed of an insulator. The insulator may include durable and heat-resistant plastic materials such as alumina, glass, silicone glass, quartz, polyether ether ketone (PEEK), polyolefin, and the like.
(21) In consideration of a direction of a current flowing through the pickup coil 103a, the pickup coil 103a may be wound in a left to right direction with respect to a first layer winding, and may be wound in a right to left direction with respect to a second layer winding after the first layer winding ends. That is, the pickup coil 103a may include a first winding portion wound in a direction from one end of the bobbin 102a toward another end of the bobbin 102a, and a second winding portion wound in a direction opposite to the first winding portion.
(22) By winding in a zigzag as described above, the pickup coil may be wound in the same direction as a direction in which a current flows through the coil, thereby increasing a magnitude of an induced magnetic flux. In general, it is possible to obtain an induced electromotive force in accordance with Faraday's law from the pickup coil 103a of the sensor, based on a principle of the weak magnetic field detection sensor.
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(24) In the above equation, a cross-sectional area A of the ferromagnetic core 101 and the number of turns N of the wound pickup coil 103a may be parameters for improving sensitivity of the sensor. Here, as the number of turns N of the pickup coil 103a increases, the sensitivity of the sensor may be improved. In this example embodiment, the sensor may be implemented by varying the number of turns N of the pickup coil 103a of the sensor. The desired number of turns N of the pickup coil 103a may be adjusted while stacking a first layer, a second layer, . . . , an N layer in a zigzag form. The pickup coil 103a wound around the alumina insulating tube 102 is illustrated in operation 1 of
(25) Referring to
(26) Here, another parameter may be considered to improve the sensitivity of the weak magnetic field detection sensor. The number CN of amorphous wires (see
(27) For example, as illustrated in a right portion of operation 2a of
(28) Referring to
(29) Specifically, the substrate may have an opening 104 passing through a central portion thereof in a rectangular shape. The alumina insulating tube 102 into which the ferromagnetic core 101 is inserted may be positioned in the opening 104.
(30) In addition, the substrate may include core pads 106a and 106b connected to the ferromagnetic core 101 and coil pads 107a and 107b connected to the pickup coil 103a. However, when the ferromagnetic core 101 that is an amorphous wire is mounted on the core pads 106a and 106b of the PCB substrates 100a and 100b by soldering, it may be difficult to directly solder the amorphous wire to the core pads 106a and 106b due to its inherent characteristic. Accordingly, a plating portion formed of gold or silver for bonding to the core pads 106a and 106b may be formed at opposite ends of the amorphous wire, and the plating portion may be bonded to the core pads 106a and 106b of the PCB substrates 100a and 100b by low-temperature soldering.
(31) Opposite ends of the pickup coil 103a wound around the alumina insulating tube 102 may be connected to the coil pads 107a and 107b through soldering, respectively. The core pad 106a may be connected to an input pad 105a through a signal line formed on one side surface 100a of the substrate, and another side surface 105b of the input pad 105a may be grounded GND. An SMA connector may be connected to the input pads 105a and 105b.
(32) In addition, the coil pads 107a and 107b connected to the pickup coil 103a may be connected to an output pad 108a by the signal line formed on the one side surface of the substrate. Another side surface 108b of the output pad 108a may be grounded, and the SMA connector may be connected to the output pads 108a and 108b.
(33) The core pads 106a and 106b and the coil pads 107a and 107b may be connected to a ground on a rear surface 100b of the PCB substrate through via holes 106c and 107c, respectively. In addition, a front surface 100a of the PCB substrate also may be grounded GND, except the core pads 106a and 106b, the coil pads 107a and 107b, the input pad 105a, the output pad 108a, and the signal line. Accordingly, the RF weak magnetic field detection sensor according to example embodiments may secure the ground as much as possible on both the front and rear surfaces 100a and 100b of the PCB substrate, thereby preventing the occurrence of a drift problem of the weak magnetic field detection sensor. That is, whereas a magnetic sensor generally fails to secure a ground, and thus separates grounds of an input terminal and an output terminal, the RF weak magnetic field detection sensor according to example embodiments may use the grounds of the input terminal and the output terminal in common. Instead, the RF weak magnetic field detection sensor may be configured to secure the ground as much as possible.
(34) Referring to operation 2b of
(35) The parallel-type fluxgate sensor may have a configuration in which a secondary coil (pickup coil 103a) is wound around the outer diameter of the cylindrical bobbin 102a, as illustrated in operation 1 of
(36) In operation 2b of
(37) In addition, an excitation coil 103b that is a primary coil may be wound around the Ni—Zn ferrite core 101 in a left to right direction, for example. Further, the ferromagnetic core 101 around which the excitation coil is wound may be inserted into the core hole 102b formed in the insulating tube 102 formed of PEEK.
(38) In this case, unlike the amorphous wire, the soft magnetic ferrite core may have a characteristic that there is little influence resulting from stress even when a coil with a diameter of several mm or more is directly wound around the core. In addition, the coil may be wound in a zigzag, including the first winding portion and the second winding portion, in the same manner as illustrated in operation 2a of
(39) The ferromagnetic core 101 may include a single core or two or more multi-cores. Even when configuring the parallel-type fluxgate sensor, in the same manner as the orthogonal fluxgate sensor, an increase in the number CN of ferromagnetic cores (see
(40) The RF weak magnetic field detection sensor according to this example embodiment may have a configuration in which the ferromagnetic core 101 formed of a soft magnetic ferrite core and the excitation coil (primary coil 103b) wound directly around the ferromagnetic core 101 are inserted into the core hole 102a formed in the bobbin 102a formed of PEEK, and the pickup coil (secondary coil 103a) is wound around the bobbin 102a formed of PEEK. In this case, the primary coil 103b may be used as an input terminal that applies a current, and the secondary coil 103a may be used as an output terminal that outputs an induced voltage.
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(42) Specifically, the multi-core may be configured by changing the number CN of the core holes 102b provided in the insulating tube 102 to 1, 2, 3, . . . , N, and correspondingly increasing the number CN of the ferromagnetic cores 101. That is, the number CN of the core holes 102b formed to pass through the bobbin 102a may represent the number CN of the ferromagnetic cores 101. In general, when the number of ferromagnetic cores 101 increases, the sensitivity may tend to exponentially increase, as illustrated in
(43) The core hole 102b of the alumina insulating tube 102 may be formed to have a size several times larger than a diameter of an amorphous wire that is the ferromagnetic core 101. In addition, N amorphous wires 101 may be inserted into the core hole 102b at once by increasing the number CN of amorphous wires. The multi-core may be configured in such a structure, thereby improving the sensitivity.
(44) In this case, in the N amorphous wires included in the ferromagnetic core 101, magnetization may cause interaction with each other, and thus the sensitivity may increase exponentially as illustrated in
(45) Furthermore, as can be seen from Faraday's law of induction, as the cross-sectional area A of the ferromagnetic core 101 increases, the sensitivity of the sensor may be improved. A size S of a bobbin according to example embodiment may also affect an improvement in sensitivity.
(46) For example, a diameter S of the alumina insulating tube 102 used as the insulator bobbin of
(47) The interval may be associated with the diameter S of the alumina insulating tube. When a current is applied to the core and an external magnetic field is applied to the core, magnetization may occur, and a resulting change in a magnetic flux may be detected by the pickup coil to obtain an induced electromotive force. A distance (interval) between the ferromagnetic core 101 and the pickup coil 103a may be an important factor for improving sensitivity. In other words, a size of the bobbin 102a, for example, a size S of the alumina insulating tube, may be referred to as a parameter for improving sensitivity, and the size S of the bobbin 102a may be optimized while performing a proper adjustment such as reduction or increase.
(48) In addition, in
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(50) A parameter D of
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(52) In addition, a shape of the insulator that is a bobbin may have a cylindrical shape, a square column shape, a hexagonal column shape, and the like, and a size S of the bobbin 102c with the same shape may be also changed as illustrated in
(53) In the above, the RF weak magnetic field detection sensor configured as a bulk type according to an example embodiment has been described with reference to
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(55) According to example embodiments, a first substrate 200a of operation 1 of
(56) In operation 1a of
(57) A via hole 201b0 may be formed in a coil pad provided at an edge of the patterned pickup coil 201a0, and the patterned pickup coil 201a0 may be connected to a coil pad 201a1 of a pickup coil 201a2 of a second PCB substrate 203a to be described later. The patterned pickup coil 201a0 may be connected to the patterned pickup coil 201a2 of the second PCB substrate 203a by the coil pad 201a1. Accordingly, all of the pickup coils 201a0, 201b0, 201a1, and 201a2 may be connected to one another.
(58) A rear surface 200b of the first PCB substrate of
(59) In operation 1b of
(60) Operation 1c of
(61) In an operation of forming a second substrate, another portion 201a2 of the pickup coil, core pads 206a and 206b, and the coil pad 201a1 may be patterned on one side surface 203a of the second substrate. Further, an input pad 204a connected to the core pads 206a and 206b and an output pad 205a connected to the coil pad 201a1 may be formed.
(62) Referring to operation 2 of
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(64) The components described in the example embodiments may be implemented by hardware components including, for example, at least one digital signal processor (DSP), a processor, a controller, an application-specific integrated circuit (ASIC), a programmable logic element, such as a field programmable gate array (FPGA), other electronic devices, or combinations thereof. At least some of the functions or the processes described in the example embodiments may be implemented by software, and the software may be recorded on a recording medium. The components, the functions, and the processes described in the example embodiments may be implemented by a combination of hardware and software.
(65) A number of example embodiments have been described above. Nevertheless, it should be understood that various modifications may be made to these example embodiments. For example, suitable results may be achieved if the described techniques are performed in a different order and/or if components in a described system, architecture, device, or circuit are combined in a different manner and/or replaced or supplemented by other components or their equivalents.
(66) Accordingly, other implementations are within the scope of the following claims.