A multilayer coil component includes a body including laminated ferrite layers, a coil conductor including conductive layers laminated in the body, and a pair of outer electrodes. Each of the outer electrodes is electrically connected to a corresponding one of end portions of the coil conductor. At least one of the conductive layers has a constricted portion at an end portion thereof. Each of the conductive layers includes a first conductive layer and a second conductive layer. The first conductive layer has a thickness different from the second conductive layer.

A method of fabricating an inductor includes (a) forming a ferromagnetic core on a semiconductor substrate, the ferromagnetic core lying in a core plane and (b) fabricating an inductor coil that winds around the ferromagnetic core, the inductor coil configured to generate an inductor magnetic field that passes through the ferromagnetic core in a first direction parallel to the core plane. While forming the ferromagnetic core, the method further includes (1) generating a bias magnetic field that passes through the ferromagnetic core in a second direction that is orthogonal to the first direction, and (2) inducing a magnetic anisotropy in the ferromagnetic core with the bias magnetic field.

An inductor includes a housing composed of an insulating material and a conical coil provided inside the housing. The conical coil is formed of a spirally wound coil conductor. The winding diameter of the conical coil increases in a continuous manner. The coil conductor has a rectangular cross section. Parts of the coil conductor that are adjacent to each other in a winding axis direction of the conical coil are disposed so as to partially overlap when looking in the winding axis direction of the conical coil. The insulating material of the housing is disposed without any gaps along the periphery of the coil conductor.

Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.

An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.

An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes an inductor. The inductor includes a plurality of line portions and a plurality of plate portions connected to the plurality of line portions. The line portions and the plate portions form a coil concentric to a horizontal axis.

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a package substrate and a first region in the package substrate. In an embodiment, the first region comprises first conductive routing. The electronic package may further comprise a second region in the package substrate. In an embodiment, the second region comprises second conductive routing. In an embodiment, the second conductive routing is embedded in a magnetic material.

An inductor component comprising a single-layer glass plate of a rectangular parallelepiped shape with a width, a length longer than the width, and a height, and having a bottom surface defined by the length and width and a top surface positioned on a back side of the bottom surface; bottom-surface and top-surface conductors disposed above the bottom and top surfaces, respectively; through wirings each extending through a corresponding one of through holes formed in the glass plate; an underlying insulation layer above the bottom-surface conductors; and first and second terminal electrodes above the underlying insulation layer. The bottom-surface and top-surface conductors, and the through wirings are electrically connected as a circularly extending wiring that circularly extends around a winding axis parallel to the bottom surface and the length. The circularly extending wiring, and the first and second terminal electrodes, are electrically connected to each other as an inductor element.

A coil component includes a body having first and second surfaces opposing each other in a first direction, first to third coil portions spaced apart from each other in the first direction in the body and having turns wound in the same direction, and an external electrode disposed on the body and connected to each of the first to third coil portions, wherein the number of turns of a portion of the first coil portion disposed in a region between a winding center of the first coil portion and the first surface is greater than the number of turns of a portion of the third coil portion disposed between a winding center of the third coil portion and the second surface, and wherein a distance between the first and second coil portions is wider than a distance between the second and third coil portions.

A magnetic material may be fabricated with a plurality of magnetic filler particles dispersed within a carrier material, wherein at last one of the magnetic filler particles may comprise a ferromagnetic core coated with an inert material to form a shell surrounding the ferromagnetic core. Such a coating may allow for the use of ferromagnetic materials for forming embedded inductors in package substrates without the risk of being incompatible with fabrication processes used to form these package substrates.