Disclosed is a wireless monitoring system for a coal-gangue mixing ratio based on a non-Hermite technology, including a signal generation monitoring device, an excitation coil, a receiving coil and a parallel plate capacitor. The signal generation monitoring device is connected with the excitation coil; the receiving coil is connected with the parallel plate capacitor to form an LC resonance system; the receiving coil is placed in parallel with the excitation coil, and the axis of the receiving coil and the axis of the excitation coil are on a same horizontal line; the signal generation monitoring device is used to generate a pulse current and collect reflected signals; the excitation coil excites an initial magnetic field based on the generated pulse current, and the LC resonance circuit performs an electromagnetic field induction to generate an induced magnetic field, and feeds back the reflected signals to the signal generation monitoring device.

An inductor component includes an element body; and a coil on the element body and wound into a spiral shape along an axis. The element body includes a substrate having first and second principal surfaces facing each other. The coil includes at least one first coil wiring on the first principal surface, at least one second coil wiring on the second principal surface, at least one first through wiring penetrating the substrate from the first principal surface to the second principal surface, and at least one second through wiring penetrating the substrate from the first principal surface to the second principal surface, and on a side opposite to the first through wiring with respect to the axis. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in sequence to constitute at least a part of the spiral shape.

The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.

A multilayer coil component includes a multilayer body which includes stacked insulating layers and incorporates a coil, and outer electrodes on an outer surface of the multilayer body and are electrically connected to the coil. The coil includes coil conductors which are stacked together with the insulating layers are electrically connected together. The coil conductors each include inner and outer end faces which face each other in a direction orthogonal to a stacking direction of the multilayer body in a section in a width direction of the one of the coil conductors. At least one end face of the inner end face and the outer end face in at least one coil conductor includes a first surface and a second surface which is continuous with the first surface and is different in an angle with respect to a plane perpendicular to the stacking direction from the first surface.

A coil component includes an insulating layer; an annular ring-shaped coil core embedded in the insulating layer; a coil electrode wound around the coil core; an input electrode designed for external connection, disposed on a lower surface of the insulating layer, and connected to a first end of the coil electrode; and an output electrode designed for external connection, disposed on the lower surface of the insulating layer, and connected to a second end of the coil electrode. One of the input electrode and the output electrode is disposed inside the coil core in a plan view. With this configuration, unlike a conventional coil component in which both input and output electrodes are disposed outside a coil core, it is possible not only to easily reduce the area of the coil component in a plan view, but also to improve heat dissipation characteristics of the coil component.

A coil-type electronic component comprises an element including a magnetic element body and a coil conductor. A portion of the magnetic element body in between layers of the coil conductor adjacent to each other in an axis direction of the coil conductor includes first soft magnetic metal particles. A portion of the magnetic element body on an outer side along the axis includes second soft magnetic metal particles. The first soft magnetic metal particles have a saturation magnetization (Ms) higher than that of the second soft magnetic metal particles.

An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.

A microelectronic device has bump bonds and an inductor on a die. The microelectronic device includes first lateral conductors extending along a terminal surface of the die, wherein at least some of the first lateral conductors contact at least some of terminals of the die. The microelectronic device also includes conductive columns on the first lateral conductors, extending perpendicularly from the terminal surface, and second lateral conductors on the conductive columns, opposite from the first lateral conductors, extending laterally in a plane parallel to the terminal surface. A first set of the first lateral conductors, the conductive columns, and the second lateral conductors provide the bump bonds of the microelectronic device. A second set of the first lateral conductors, the conductive columns, and the second lateral conductors are electrically coupled in series to form the inductor. Methods of forming the microelectronic device are also disclosed.

Disclosed is an apparatus including a plurality of vias each having a defined shape, wherein each of the plurality of vias includes a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape, a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer. The apparatus further includes a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

A multilayer coil component includes an element body including soft magnetic metal powders and a coil disposed in the element body. The coil includes a plurality of internal conductors electrically connected to each other. The plurality of internal conductors are separated from each other in a first direction and are adjacent to each other in the first direction. An average particle diameter of the soft magnetic metal powders located at an inner side of the coil when viewing from the first direction is larger than an average particle diameter of the soft magnetic metal powders located between the internal conductors adjacent to each other in the first direction.