An inductor component comprising a base; a coil in the base body and wound along a direction of an axis; and first and second external electrodes disposed on the base body and electrically connected to the coil. The base body includes first and second end surfaces and a second end surface at ends in the length direction, first and second side surfaces at ends in the width direction, and bottom and top surfaces at ends in the height direction. The first and second external electrodes are respectively disposed toward the first and second end surfaces with respect to a center in the length direction and exposed from an outer surface of the base body. When viewed from the first end surface in the length direction, at least a part of a respective portion of the first and second external electrodes exposed from the outer surface do not overlap.

An inductor device includes a first inductor unit and a second inductor unit. The first inductor unit includes a first side to a fourth side, a first wire, and a first input terminal. The first wire is winded to form a plurality of circles. The first wire is winded in an interlaced manner at one of the first to fourth sides of the first inductor unit. The first input terminal is disposed on one of the first to fourth sides. The second inductor unit includes a fifth side to an eighth side, a second wire, and a second input terminal. The second wire is winded to form a plurality of circles. The second wire is winded in an interlaced manner at one of the fifth to eighth sides of the second inductor unit. The second input terminal is disposed on one of the fifth to eighth sides.

A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

An inductor comprising a component main body including a non-conductive material, and a coil inside the component main body and having a plurality of line conductors, each extending along a principal surface of the component main body, and a plurality of via conductors each extending perpendicularly to the principal surface of the component main body. The plurality of via conductors include a curved via conductor in a long and curve shape extending along a first line conductor which is one of the line conductors and is connected to the curved via conductor.

An electronic component comprising a glass body containing a photosensitizer; a conductor as at least a part of an electric element, arranged on the glass body; a terminal electrode as a terminal of the electric element, arranged above an outer surface of the glass body, with the terminal electrode being electrically connected to the conductor; and an insulating film arranged above the outer surface of the glass body. The insulating film reflects or absorbs light in a photosensitive wavelength range of the photosensitizer contained in the glass body.

Disclosed are a device and techniques for fabricating the device. The device may include a top substrate including a plurality of top vias coupled to a first top metal layer that forms a top winding portion of a first inductor. The device also includes a middle substrate including one or more middle metal layers. The top substrate is disposed on the middle substrate. The one or more middle metal layers form a middle winding portion of the first inductor. The device also includes a bottom substrate electrically coupled to the middle substrate opposite the top substrate, where a first bottom metal layer of the bottom substrate forms a bottom winding portion of the first inductor.

An electronic component includes a stack and an inductor wound about an axis orthogonal to a stacking direction. The inductor includes a first conductor layer portion and two through hole columns. The first conductor layer portion includes two conductor layers disposed at positions different from each other in the stacking direction and connected in parallel to each other. Area of a first conductor layer is larger than area of a second conductor layer.

Disclosed are redistribution substrates and semiconductor packages including the same. The semiconductor package comprises a redistribution substrate, a semiconductor chip mounted on the redistribution substrate, and an inductor structure in the redistribution substrate and electrically connected to the semiconductor chip. The inductor structure includes an outer coil pattern including a plurality of vertical parts and a horizontal part that connects the plurality of vertical parts to each other, and an inner coil pattern between the vertical parts and electrically connected to the outer coil pattern. The horizontal part includes a first conductive layer, and a second conductive layer between the first conductive layer and the inner coil pattern. The second conductive layer has a thickness that is less than a thickness of the first conductive layer.

An inductor component includes an element body; and a coil on the element body and wound into a spiral shape along an axis. The element body includes a substrate having first and second principal surfaces facing each other. The coil includes at least one first coil wiring on the first principal surface, at least one second coil wiring on the second principal surface, at least one first through wiring penetrating the substrate from the first principal surface to the second principal surface, and at least one second through wiring penetrating the substrate from the first principal surface to the second principal surface, and on a side opposite to the first through wiring with respect to the axis. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in sequence to constitute at least a part of the spiral shape.

A multilayer coil component includes a multilayer body which includes stacked insulating layers and incorporates a coil, and outer electrodes on an outer surface of the multilayer body and are electrically connected to the coil. The coil includes coil conductors which are stacked together with the insulating layers are electrically connected together. The coil conductors each include inner and outer end faces which face each other in a direction orthogonal to a stacking direction of the multilayer body in a section in a width direction of the one of the coil conductors. At least one end face of the inner end face and the outer end face in at least one coil conductor includes a first surface and a second surface which is continuous with the first surface and is different in an angle with respect to a plane perpendicular to the stacking direction from the first surface.