An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

An inductor or transformer with the inductor can include one or more windings split into strands along a radial path of the winding and provide for a more uniform current distribution across a width of the winding. The winding(s) can comprise twisting components as twistings or strand crossings located at various locations along the winding. The twisting components span the winding along a winding width with a connector or crossing strand and change a position of one strand to another at points that different strands of the winding are cut or spliced.

An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

A circuit assembly may include a first layer arranged as a substrate, a second layer having a spiral pattern attached to the substrate, wherein the spiral pattern contains a deformable conductor. A circuit assembly may include a first portion of a deformable inductor fabricated on a first layer of the circuit assembly; and a second portion of the deformable inductor fabricated on a second layer of the circuit assembly and electrically connected to the first portion of the deformable inductor. A method may include sensing an interaction with a deformable inductor, wherein the deformable inductor may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor. An article of manufacture may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor.

An integrated inductor includes a first coil and a second coil. The first coil has at least one first turn disposed in a first area and at least one second turn disposed in a second area, a number of the at least one first turn is different from a number of the at least one second turn. The second coil has at least one third turn disposed in the first area and at least one fourth turn disposed in the second area, a number of the at least one third turn is different from a number of the at least one fourth turn. The number of the at least one first turn is different from the number of the at least one third turn, and the number of the at least one second turn is different from the number of the at least one fourth turn.

A single-ended inductor comprises a first partial coil wound in a first direction; and a second partial coil wound in a second direction and adjoined the first partial coil; wherein, the second direction is opposite to the first direction to reduce the coupling of single-ended inductors and peripheral lines and reduce signal interference.

An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes at least two sub-traces. One terminal of each of the at least two sub-traces are coupled to each other at a first node. The second trace includes at least two sub-traces. One terminal of each of the at least two sub-traces are coupled to each other at a second node. The capacitor is coupled to the firs node and the second node.

An inductor device includes first trace, second trace, third trace, fourth trace, first capacitor, and second capacitor. One terminal of each of the at least two sub-traces of first trace are coupled to each other at first node. One terminal of each of the at least two sub-traces of second trace are coupled to each other at second node. One terminal of third trace is coupled to second trace, and another terminal of third trace is coupled to first input/output terminal. One terminal of fourth trace is coupled to first trace, and another terminal of fourth trace is coupled to second input/output terminal. First capacitor is coupled to first node and second node. Second capacitor is coupled between firs node and first input/output terminal, or coupled between first node and second input/output terminal, or coupled between first input/output terminal and second input/output terminal.

Aspects generally relate to adjusting, or lowering, the Q of an inductor. In one embodiment, an integrated circuit includes an inductor and a conductive closed ring inside a periphery of the inductor. In another embodiment, there can be a plurality of closed rings inside the periphery of the inductor. The conductive closed rings are magnetically coupled to the inductor to adjust the Q.

The invention discloses crossing structures of an integrated transformer or an integrated inductor. The crossing structures can be applied to various integrated transformers or integrated inductors, and so the design of the integrated transformers or the integrated inductors becomes more flexible such that the demand for the coupling coefficient and/or quality factor can be met for various integrated transformers or integrated inductors. The crossing structures disclosed in the present invention includes multiple segments fabricated on a first metal layer of the semiconductor structure and multiple segments fabricated on a second metal layer of the semiconductor structure, the first metal layer being different from the second metal layer.