An integrated inductor includes a first coil and a second coil. The first coil has at least one first turn disposed in a first area and at least one second turn disposed in a second area, a number of the at least one first turn is different from a number of the at least one second turn. The second coil has at least one third turn disposed in the first area and at least one fourth turn disposed in the second area, a number of the at least one third turn is different from a number of the at least one fourth turn. The number of the at least one first turn is different from the number of the at least one third turn, and the number of the at least one second turn is different from the number of the at least one fourth turn.

A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.

An 8-shaped integrated inductor includes a first terminal; a second terminal; a third terminal; a bridging structure that includes a first metal segment and a second metal segment, the first metal segment and the second metal segment being disposed in different layers of a semiconductor structure and partially overlapping; a first sensing unit employing the first terminal and the third terminal as its two terminals and including the first metal segment; and a second sensing unit employing the second terminal and the third terminal as its two terminals and including the second metal segment and a third metal segment. The third metal segment is disposed at a metal layer different from the second metal segment and conductively connecting other metal segments of the second sensing unit without crossing the metal segments of the first sensing unit.

An 8-shaped integrated inductor includes a first terminal; a second terminal; a third terminal; a bridging structure that includes a first metal segment and a second metal segment, the first metal segment and the second metal segment being disposed in different layers of a semiconductor structure and partially overlapping; a first sensing unit employing the first terminal and the third terminal as its two terminals and including the first metal segment; and a second sensing unit employing the second terminal and the third terminal as its two terminals and including the second metal segment and a third metal segment. The third metal segment is disposed at a metal layer different from the second metal segment and conductively connecting other metal segments of the second sensing unit without crossing the metal segments of the first sensing unit.

An electronic component includes an insulating base material substrate including a first main surface defining a mounting surface, a coil on the insulating base material substrate, and a mounting electrode on the first main surface and connected to the coil. The insulating base material substrate includes insulating base material layers laminated in a lamination direction. The coil includes a coil conductor provided on one of the insulating base material layers and a winding axis extending in the lamination direction. An area of the first main surface is smaller than an area of a section different in area from the first main surface and is closest to the first main surface, among sections parallel or substantially parallel to the first main surface.

A T-coil IC includes a first inductor on an M.sub.x layer. The first inductor has n turns, where n is at least 1 turns. The T-coil IC further includes a second inductor on an M.sub.x-1 layer. The second inductor has n turns. The first inductor and the second inductor are connected together at a node. The first inductor on the M.sub.x layer and the second inductor on the M.sub.x-1 layer are mirror symmetric to each other. The T-coil IC further includes a center tap on an M.sub.x-2-y layer, where y0. The center tap is connected to the first inductor and the second inductor by a via stack at the node. In one configuration, n is 1+0.5z turns, where z0. An effective bridge capacitance of the T-coil IC may be approximately 25 fF.

An 8-shaped integrated inductor includes a first terminal; a second terminal; a third terminal; a bridging structure that includes a first metal segment and a second metal segment, the first metal segment and the second metal segment being disposed in different layers of a semiconductor structure and partially overlapping; a first sensing unit employing the first terminal and the third terminal as its two terminals and including the first metal segment; and a second sensing unit employing the second terminal and the third terminal as its two terminals and including the second metal segment and a third metal segment. The third metal segment is disposed at a metal layer different from the second metal segment and conductively connecting other metal segments of the second sensing unit without crossing the metal segments of the first sensing unit.

An asymmetric spiral inductor fabricated in a semiconductor structure includes a spiral coil, a metal segment, and a connection structure. The spiral coil is substantially disposed in a first metal layer and includes a first terminal and a second terminal. The first terminal is disposed at an outermost turn of the spiral coil, and the second terminal is disposed at an innermost turn of the spiral coil. The metal segment is disposed in a second metal layer different from the first metal layer and has a third terminal and a fourth terminal. The connection structure connects the second terminal and the third terminal. The first terminal and the fourth terminal form the two terminals of the asymmetric spiral inductor. The spiral coil is a polygon with N sides (N>4). A portion of the metal segment has a shape substantially identical to a portion of the contour of the polygon.

An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes at least two sub-traces. One terminal of each of the at least two sub-traces are coupled to each other at a first node. The second trace includes at least two sub-traces. One terminal of each of the at least two sub-traces are coupled to each other at a second node. The capacitor is coupled to the firs node and the second node.

Disclosed herein is a coil component that includes first and second coil parts each spirally wound in a plurality of turns in directions opposite to each other. An innermost turn of the first coil part is radially divided into first and second conductor parts by a spiral slit, and at least an innermost turn of the second coil part is radially divided into third and fourth conductor parts by a spiral slit. The first conductor part is positioned radially inward of the second conductor part, and the third conductor part is positioned radially inward of the fourth conductor part. The inner peripheral end of the first conductor part is connected to the inner peripheral end of the fourth conductor part, and the inner peripheral end of the second conductor part is connected to the inner peripheral end of the third conductor part.