Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

A magnetic coupling coil element in one embodiment includes a magnetic base body that includes an intermediate magnetic layer, a first magnetic layer disposed over the intermediate magnetic layer, and a second magnetic layer disposed under the intermediate magnetic layer; a first coil conductor provided in the first magnetic layer; and a second coil conductor provided in the second magnetic layer. The intermediate magnetic layer has a saturation magnetic flux density lower than saturation magnetic flux densities of the first magnetic layer and the second magnetic layer in a first region that overlaps with the first coil conductor and the second coil conductor in plan view.

Various embodiments include, for example, a magnetic-dielectric film-based inductor that can be embedded in an electronic package for use as an integrated voltage-regulator, multiple conductive regions to provide electrical interconnects to the magnetic-dielectric-based inductor from other devices, multiple conductive pillars that are electrically coupled to and formed over at least some of the conductive regions, and a magnetic-dielectric layer formed over at least some of conductive regions and conductive pillars. The magnetic-dielectric layer is formed by a multi-layer formation technique having multiple dielectric-material layers and multiple magnetic-material layers. Each of the magnetic-material layers is interspersed with at least one of the dielectric-material layers. Other devices, apparatuses, and methods are described.

A package including a package substrate; an interposer electrically coupled to the package substrate and including a metal layer; a die including an integrated voltage regulator and electrically coupled to the interposer by solder features; and an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the interposer, the inductor electrically coupled to the integrated voltage regulator.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

An inductor can be formed in a coreless electronic substrate from magnetic materials and/or fabrication processes that do not result in the magnetic materials leaching into plating and/or etching solutions/chemistries, and results in a unique inductor structure. This may be achieved by forming the inductors from magnetic ferrites. The formation of the electronic substrates may also include process sequences that prevent exposure of the magnetic ferrites to the plating and/or etching solutions/chemistries.

An inductor can be formed in a coreless electronic substrate, such that the fabrication process does not result in the magnetic material used in the inductor leaching into plating and/or etching solutions/chemistries, and results in a unique inductor structure. This may be achieved by forming conductive vias with a lithographic process, rather than a standard laser process, in combination with panel planarization to prevent exposure of the magnetic material to the plating and/or etching solutions/chemistries.

Various magnetic thin film inductor structures are disclosed that include one or more magnetic thin film (MTF) materials. During operation, an electric field passes through one or mare conductive windings which, in turn, generates a magnetic field for storing energy within these magnetic thin film inductor structures. The magnetic thin film (MTF) materials within these magnetic thin film inductor structures effectively attract magnetic flux lines of this magnetic field. As a result, any magnetic leakage resulting from the magnetic field generated by these magnetic thin film inductor structures onto nearby electrical, mechanical, and/or electro-mechanical devices is lessened when compared to magnetic leakage resulting from the magnetic field generated by other inductor structures not having the one or more MTF materials.

The multilayer inductor includes a multilayer body including a plurality of insulating layers laminated in a lamination direction, and a plurality of coil groups arranged in the multilayer body along the lamination direction and connected in series. Each of the coil groups includes a plurality of coil patterns respectively provided on the insulating layers and laminated in the lamination direction, and is configured by connecting a plurality of pattern groups in series. Each of the pattern groups is formed by connecting n (n is a positive integer) coil patterns in parallel. The number of parallels n of at least one of the coil groups is different from the number of parallels n of another coil group. The insulating layers include magnetic and non-magnetic insulating layers. At least one of the insulating layers adjacent to one of the coil patterns is the non-magnetic insulating layer.

A coil component including an element assembly and a coil conductor embedded in the element assembly. The element assembly includes a first magnetic layer and a second magnetic layer that constitute a first principal surface and a second principal surface, respectively, where the first principal surface and the second principal surface are opposite to each other in the element assembly. The first magnetic layer has a higher relative magnetic permeability than the second magnetic layer. At least part of a winding portion of the coil conductor is located in the first magnetic layer. The first magnetic layer contains metal magnetic particles and a resin, and the second magnetic layer contains metal magnetic particles, a resin, and zinc oxide particles. The metal magnetic particles and the zinc oxide particles are dispersed in the resin.