An inductor component comprising a base body including first and second magnetic layers laminated in order along a first direction; and an inductor wire between the first and second magnetic layers and on a plane that is orthogonal to the first direction. The first magnetic layer is in a reverse direction to the first direction of the inductor wire, the second magnetic layer is in the first direction of the inductor wire and in a direction that is orthogonal to the first direction, and when a main surface of the second magnetic layer is viewed from a direction which is orthogonal to the main surface of the second magnetic layer in the first direction, the second magnetic layer includes a dark region corresponding to the inductor wire and a bright region whose brightness is higher than that of the dark region.

An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a magnetic element assembled to the stack. The magnetic element includes a magnetic matrix and an inductive element. The inductive element is at least partially enclosed by the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the stack. Further, a magnetic inlay and a manufacturing method are described.

A method for fabricating an electrical or electronic device package includes providing a first plateable encapsulation layer; activating first selective areas on a main surface of the first plateable encapsulation layer; forming a first metallization layer by electrolytic or electroless plating on the first activated areas; and fabricating a passive electrical component on the basis of the first metallization layer.

A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.

The present disclosure relates to a coil assembly. According to a first embodiment of the present disclosure, there is provided a coil assembly including a coil including a multilayer film which is extended between a first longitudinal end and a second longitudinal end of the multilayer film, which are opposite to each other, and which is wound to form a plurality of loops which are substantially concentric, wherein the multilayer film includes: cut edges which are extended between the first longitudinal end and the second longitudinal end, and are opposite to each other and are substantially parallel to each other; a metal layer; and a magnetic layer disposed on the metal layer, wherein, at one or more of the first longitudinal end and the second longitudinal end of the multilayer film, the metal layer is electrically connected to a conductive terminal.

Techniques for fabricating a cored or coreless semiconductor package having one or more magnetic bilayer structures embedded therein are described. A magnetic bilayer structure includes a magnetic layer and a dielectric layer. For one technique, fabricating a cored or coreless semiconductor package includes: depositing a seed layer on a build-up layer; forming a raised pad structure and a trace on the seed layer; removing one or more uncovered portions of the seed layer to uncover top surfaces of one or more portions of the build-up layer; applying a magnetic bilayer structure on the raised pad structure, the trace, any unremoved portion of the seed layer, and the top surfaces of the one or more portions of the build-up layer, the magnetic bilayer structure comprises a magnetic layer and a dielectric layer; and forming a conductive structure on the raised pad structure. Other techniques are also described.

A coil component includes coil portions spaced apart from each other; and a body having a first core and a second core, spaced apart from the first core, wherein the coil portions include a first coiled portion and a second coiled portion that form at least one turn about the first and second cores, respectively, and a first extension portion and a second extension portion extending from the first and second coiled portions, respectively, and each surround the first and second cores. The body further comprises spacing portions, facing each other, defined between the coiled portions and spaced apart from the first and second cores. In the first and second extension portions, a line width of each of adjacent regions adjacent to the spacing portions is greater than a line width of a region except the adjacent regions.

An electronic component comprises a magnetic substrate, a multilayer body including a plurality of insulator layers, and a plurality of coils extending inside the multilayer body. When a first magnetic substrate is viewed toward a third positive direction, an outer edge of the first magnetic substrate includes a linear side. Also, a cutout is recessed inward from the side. When a direction along the side is taken as a first direction and a direction perpendicular to the first direction is taken as a second direction when the first magnetic substrate is viewed toward the third positive direction, a maximum dimension of the cutout in the first direction is different from a maximum dimension of the cutout in the second direction.

There is provided a semiconductor device including: a circuit region formed on a semiconductor substrate; a first insulating film covering at least a portion of a region on the semiconductor substrate that includes an upper portion of the circuit region; redistribution wiring disposed on the first insulating film; a coil formed by the redistribution wiring on the first insulating film, the coil being connected to the circuit region; a first soft magnetic material film disposed in an aperture portion of the first insulating film, the aperture portion being provided at a lower portion of the coil; and a second soft magnetic material film that is disposed on the first soft magnetic material film, the second soft magnetic material film covering at least a portion of the coil.