Patent classifications
H01F2017/0066
COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
To achieve a high inductance value while reducing the entire thickness in a coil component having a structure in which spiral coil patterns are stacked. A coil component includes: a coil part having a structure in which interlayer insulating films and spirally wound coil patterns are alternately stacked in the axial direction of the coil component; and magnetic element members embedding therein the coil part. The interlayer insulating film covering, from one end side in the axial direction, one coil pattern positioned at the one end in the axial direction is higher in permeability than the interlayer insulating films. Thus, the one coil pattern positioned at the end portion is covered with the interlayer insulating film having a high permeability, so that it is possible to achieve a high inductance value while reducing the entire thickness.
COUPLED INDUCTOR AND THE METHOD TO MAKE THE SAME
A coupled inductor has two coils made by film processes, wherein a first coil is disposed on a top surface of a magnetic sheet and a second coil is disposed on a bottom surface of the magnetic sheet, for controlling the variations of the gap between the two coils in a smaller range.
Coil component and manufacturing method therefor
A coil component is provided with a coil part in which a plurality of conductor layers and a plurality of interlayer insulating layers are alternately laminated; and a sealing resin layer that covers the coil part. The conductor layers each include a spiral pattern. The interlayer insulating layers each cover an upper surface and a side surface of the spiral pattern. The recessed part is formed in the side wall surface of the interlayer insulating layer. A part of the sealing resin layer is embedded in the recessed part.
Power inductor and manufacturing method therefor
Disclosed are a power inductor and a method of manufacturing the same. The power inductor includes a body, a coil pattern provided in the body, an external electrode disposed on at least one surface of the body and extending to at least the other surface of the body, which is adjacent thereto, and a coupling layer provided between the body and an extended area of the external electrode.
DC-DC converter multilayer coil array and DC-DC converter
A multilayer coil array includes an element body; first and second built-in coils; and first to fourth outer electrodes provided on the element body. A non-magnetic layer is provided between the first and second coils. An end of the first coil extending from the coil conductor closest to the second coil among the plurality of coil conductors of the first coil is connected to the first outer electrode and another end of the first coil is connected to the second outer electrode. An end of the second coil extending from the coil conductor closest to the first coil among the plurality of coil conductors of the second coil is connected to the third outer electrode and another end portion of the second coil is connected to the fourth outer electrode. The second and fourth outer electrodes are connected to output terminals of a switching element of a DC-DC converter.
Coil component
A coil component includes a body including a plurality of effective layers stacked in one direction; a coil portion embedded in the body, the coil portion including a plurality of coil patterns respectively disposed in the plurality of effective layers, the coil portion further including a lead-out pattern; and a core penetrating through an interior of the coil portion, wherein the coil portion further includes a resistance reducing portion extending from an outer circumferential surface of each of the coil patterns to an outside of the core in a respective one of the effective layers in a radially outward direction of the coil portion.
Inductive devices and methods of forming inductive devices
An inductive device may be provided, including a substrate and an inductive structure arranged over the substrate. The inductive structure may include a bottom metal winding layer; a top metal winding layer arranged further away from the substrate than the bottom metal winding layer; a magnetic core layer arranged between the bottom metal winding layer and the top metal winding layer; a connector arranged to electrically connect the bottom metal winding layer and the top metal winding layer; and a top metal ring element arranged around the top metal winding layer, spaced apart from the top metal winding layer. The inductive device may further include a guard ring element arranged under the top metal ring element and around the magnetic core layer, spaced apart from the magnetic core layer; wherein the guard ring element may include a magnetic material.
Electronic component
An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.
Inductor component
An inductor component that includes an element body; a coil wiring line that is arranged parallel to a first main surface of the element body inside the element body; and a first vertical wiring line and a second vertical wiring line that are buried inside the element body so that end surfaces thereof are exposed from the first main surface of the element body and that are electrically connected to the coil wiring line. In a first cross section that is perpendicular to a direction in which the coil wiring line extends and intersects the first vertical wiring line, a top surface of the coil wiring line contacts a bottom surface of the first vertical wiring line and the top surface of the coil wiring line is substantially shaped like a convex surface.
Multilayer coil component and electronic device
In an exemplary embodiment, a multilayer coil component includes: a substrate body; and a coil embedded in the substrate body and containing a wound conductor; wherein the substrate body has: magnetic layers containing multiple metal magnetic grains, provided around conductor layers that constitute parts of the wound conductor in a direction roughly orthogonal to the coil axis of the coil; and multiple high-hardness insulating grains harder than the multiple metal magnetic grains and smaller in average grain size than the multiple metal magnetic grains, provided between a pair of the conductor layers adjacent to each other in the direction of the coil axis and also between a pair of the magnetic layers adjacent to each other in the direction of the coil axis. The multilayer coil component can prevent shorting in the wound conductor while increasing the inductance.