A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover at least parts of first and second end surfaces. A stacking direction and a coil axis direction are parallel to the first main surface. A length of a region in which the coil conductors are arranged in the stacking direction is from 85% to 95% of a length of the multilayer body. A distance between coil conductors adjacent to each other in the stacking direction lies in a range from 12 μm to 40 μm.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers on top of one another and that has a coil built thereinto, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors to one another. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body and an axial direction of the coil are parallel to the mounting surface. The insulating layers between the coil conductors are composed of a material containing at least one out of a magnetic material and a non-magnetic material. A content percentage of the non-magnetic material in the insulating layers changes in a direction from a first end surface toward a second end surface of the multilayer body.

The present disclosure relates to inductor structures and fabricating methods. One example inductor structure includes a first magnetic material layer, an insulation layer, where the insulation layer comprises a polymer structure with longitudinal length which greater than lateral length, the polymer structure comprises an arched upper surface, a first side surface, a second side surface, a bottom surface in a longitudinal direction, at least one of a corner between the arched upper surface and the first side surface and a corner between the arched upper surface and the second side surface is a rounded corner, and at least one of an angle formed between the first side surface and the bottom surface and an angle formed between the second side surface and the bottom surface is less than 90 degree, at least one conductive wire structure passing through the insulation layer, and a second magnetic material layer.

An inductor conductor is configured such that, with respect to a height-wise dimension of the inductor conductor between the top surface and the bottom surface thereof, the height-wise dimension of a central portion of the top surface is smaller than the height-wise dimension of an edge portion of the top surface at a cross section of the inductor conductor taken in a direction orthogonal to an extending direction of the inductor conductor.

Described herein are magnetic core inductors (MCI) and methods for manufacturing magnetic core inductors. A first embodiment of the MCI can be a snake-configuration MCI. The snake-configuration MCI can be formed by creating an opening in a base material, such as copper, and providing a nonconductive magnetic material in the opening. The inductor can be further formed by forming plated through holes into the core material. The conductive elements for the inductor can be formed in the plated through holes. The nonconductive magnetic material surrounds each conductive element and plated through hole. In embodiments, a layered coil inductor can be formed by drilling a laminate to form a cavity through the laminate within the metal rings of the layered coil inductor. The nonconductive magnetic material can be provided in the cavity.

Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.

To provide an electronic component having printing, which can achieve both of a moisture resistance capability and visibility of printing, and a method of manufacturing the same. A method of manufacturing an electronic component having printing, including preparing an electronic component before being subjected to printing, which is provided with a magnetic element body made of an alloy magnetic material containing a transition metal on a surface thereof, and a glass layer that contains Bi with which the magnetic element body is at least partly coated and does not contain a transition metal, and irradiating the electronic component before being subjected to printing with laser light having a wavelength of 1064 nm so that the laser light is transmitted through the glass layer, so that a printing portion is formed at a partial glass portion in a vicinity of an interface between the magnetic element body and the glass layer.

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.

An inductor component comprising a first magnetic layer, a spiral wiring disposed on the first magnetic layer, and a second magnetic layer covering the spiral wiring. The first magnetic layer and the second magnetic layer contain a magnetic powder and a resin containing the magnetic powder, and the spiral wiring includes a spiral-shaped first conductor layer and a second conductor layer disposed on the first conductor layer and shaped along the first conductor layer.

An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.