H01F2017/0066

COMMON MODE CHOKE COIL

One object is to reduce, in a common mode choke coil having three coil conductors, a deviation in stray capacities generated between the coil conductors. A common mode choke coil according to one embodiment of the present invention includes a first coil conductor, a second coil conductor, and a third coil conductor. In said embodiment, the first coil conductor, the second coil conductor, and the third coil conductor extend parallel with each other in a first region in plan view as seen from an axial direction along the coil axis. In said embodiment, in the first region, when seen in a cross section cut along a plane including the coil axis, in an n-th turn, an arranging order of the first coil conductor, the second coil conductor, and the third coil conductor from an inner side in a radial direction thereof is inverted from that in an n+1th turn.

COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME

A coil component that can be made thinner while ensuring sufficient magnetic characteristics includes a magnetic part, a conductor part, and multiple insulator parts. The magnetic part is constituted by magnetic alloy grains. The conductor part has multiple winding parts and is wound around one axis inside the magnetic part. The multiple insulator parts are each placed between the multiple winding parts, each having a winding shape that includes two joining surfaces that are respectively joined to two winding parts facing each other at least partially in the direction of the one axis, and are each constituted by electrically insulating grains.

Electronic component
09847162 · 2017-12-19 · ·

An electronic component includes a body formed of an insulator, a coil positioned in the body and including first and second coil conductors, an outer electrode including a first bottom-surface electrode and a first substantially columnar electrode (first electrode) and connected to the second conductor, and an outer electrode including a second bottom-surface electrode and a second substantially columnar electrode (second electrode) and connected to the first conductor. The second conductor is positioned between the first conductor and a bottom surface of the body. The second electrode is positioned to oppose the first electrode across the coil's central axis when viewed from the z-axis direction. An outermost peripheral portion of the first conductor is superposed with the first electrode when viewed from the z-axis direction. A smallest distance between the first conductor and a first side surface is smaller than that between the second conductor and a second side surface.

MULTI-LAYER SENSOR CORE
20170358388 · 2017-12-14 ·

A sensor may include a core and a coil. The core may include a rectangular substrate, a layer of magnetically-permeable material disposed on the substrate, and an adhesive rigidly coupling two ends of the substrate so as to form a tube with the rectangular substrate. The coil may be wound on the tube. The core may further include a layer of radiopaque material. The core may further include a flex pad for electrically coupling the coil with an external system.

Semiconductor Package, Semiconductor Die and Method for Forming a Semiconductor Package or a Semiconductor Die

A semiconductor package comprises a semiconductor die and a wiring structure, which is electrically connected to the semiconductor die. Further, the semiconductor package comprises a magnetic material. The magnetic material embeds and/or encircles a portion of the wiring structure.

Inductor component

An inductor component comprises an element body; first and second inductors in the body; first and second columnar wirings in the body with end surfaces exposed from a first principal surface of the body and electrically connected to the first inductor; third and fourth columnar wirings in the body with end surfaces exposed from the first principal surface and electrically connected to the second inductor; first through fourth external terminals contacting the end surfaces of the first through fourth columnar wirings, respectively; and an insulating film on the first principal surface covering a portion of the end surface of the first and third columnar wiring not contacting the first and third terminals, respectively. The first terminal is closer to the third terminal than the fourth terminal, and a shortest distance between the first and third terminals is longer than a shortest distance between the first and third columnar wirings.

ELECTRONIC COMPONENT
20170352475 · 2017-12-07 · ·

An electronic component having an electric element including a coil, a magnetic layer covering at least a portion of the electric element, a plurality of external terminals electrically connected to the electric element and embedded in the magnetic layer to be partially exposed from one surface of the magnetic layer, and a nonmagnetic layer embedded in the magnetic layer. The plurality of external terminals include at least one or more first external terminals. The first external terminals are surrounded by the nonmagnetic layer when viewed from the one surface side of the magnetic layer.

Micromagnetic device and method of forming the same

A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device.

INDUCTOR COMPONENT AND METHOD OF MANUFACTURING INDUCTOR COMPONENT

An inductor component includes an element body, a coil disposed in the element body, and a non-magnetic insulating layer configured to cover at least part of the coil. The element body has a first magnetic layer and a second magnetic layer stacked in order along a first direction. The coil has an inductor wiring extending along a plane orthogonal to the first direction between the first magnetic layer and the second magnetic layer. In a first section orthogonal to an extending direction of the inductor wiring, the inductor wiring has a top surface facing the first direction, a bottom surface facing a second direction as a reverse direction of the first direction, a first side surface facing a third direction orthogonal to the first direction, and a second side surface facing a fourth direction as a reverse direction of the third direction.

INDUCTOR COMPONENT AND METHOD OF MANUFACTURING INDUCTOR COMPONENT

An inductor component includes an element body, a coil in the element body, and a non-magnetic insulation layer covering at least part of the coil. The element body includes first and second magnetic layers laminated in order in a first direction. The coil includes a small-turn inductor wiring of 0.5 or less turns extending along a plane orthogonal to the first direction between the first and second magnetic layers. In a first cross-section orthogonal to an extending direction of the small-turn inductor wiring, the small-turn inductor wiring has a top surface facing in the first direction, a bottom surface facing in a second direction opposite from the first direction, a first side surface facing in a third direction orthogonal to the first direction, and a second side surface facing in a fourth direction opposite from the third direction.